 |
|
• AEC-Q100 qualified for automotive applications:
– Temperature grade 1:–40°C to +125°C, TA
– Device HBM ESD classification level H2
– Device CDM ESD classification level C3B
|
| • Wide input voltage range: 3 V to 60 V
|
| • Ultra-low quiescent current: 5 μA |
| • Quiescent current at shutdown: 1 μA |
| • Output current: 100 mA |
| • Low dropout voltage: 60 mV at 20 mA |
| • Accuracy: 2%
|
• Available in:
– Fixed output voltage: 3.3 V, 5 V
– Adjustable version from approximately 1.2 to
18.5 V |
| • Power-good with programmable delay |
| • Current-limit and thermal shutdown protections |
| • Stable with ceramic output capacitors:
≥ 2.2 µF
|
• Functional Safety-Capable
– Document available to aid functional safety
system design |
| • Package: High-thermal-performance, 8-pin
HVSSOP thermal pad package |
|
| CATALOG |
| TPS7A1601QDGNRQ1 COUNTRY OF ORIGIN |
| TPS7A1601QDGNRQ1 PARAMETRIC INFO |
| TPS7A1601QDGNRQ1 PACKAGE INFO |
| TPS7A1601QDGNRQ1 MANUFACTURING INFO |
| TPS7A1601QDGNRQ1 PACKAGING INFO |
| TPS7A1601QDGNRQ1 ECAD MODELS |
| TPS7A1601QDGNRQ1 FUNCTIONAL BLOCK DIAGRAM
|
| TPS7A1601QDGNRQ1 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Thailand |
|
| PARAMETRIC INFO |
| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
0.1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Output Voltage Range (V) |
<1.8|1.8 to 10|10 to 20 |
| Output Type |
Adjustable |
| Junction to Ambient |
66.2°C/W |
| Junction to Case |
45.9°C/W |
| Polarity |
Positive |
| Special Features |
Current Limit|Thermal Shutdown Protection |
| Load Regulation |
1%(Typ) |
| Line Regulation |
1%(Typ) |
| Minimum Input Voltage (V) |
3 |
| Maximum Input Voltage (V) |
60 |
| Output Voltage (V) |
1.2 to 18.5 |
| Typical Quiescent Current (mA) |
0.005 |
| Typical Dropout Voltage @ Current (V) |
0.06@20mA |
| Reference Voltage (V) |
1.217 |
| Accuracy (%) |
±2 |
| Supplier Temperature Grade |
Automotive |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Output Capacitance (uF) |
2.2(Min) |
|
| |
| PACKAGE INFO |
| Supplier Package |
HVSSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Very Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
AuAg |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM
|
 |
|
| APPLICATIONS |
| • Emergency call (eCall) |
| • Battery management systems (BMS)
|
| • Onboard (OBC) and wireless chargers |
| • DC/DC converters |
|
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