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• Input Voltage Range: +3 V to +36 V
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• Output Current: 1 A
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• Dropout Voltage: 307 mV at 1 A
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• CMOS Logic Level-Compatible Enable Pin
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|
| CATALOG |
TPS7A4700RGWR COUNTRY OF ORIGIN
|
TPS7A4700RGWR PARAMETRIC INFO
|
TPS7A4700RGWR PACKAGE INFO
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TPS7A4700RGWR MANUFACTURING INFO
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TPS7A4700RGWR PACKAGING INFO
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TPS7A4700RGWR ECAD MODELS
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TPS7A4700RGWR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
Philippines
|
Thailand
|
Malaysia
|
|
PARAMETRIC INFO
|
| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Output Type |
Adjustable |
| Junction to Ambient |
32.5°C/W |
| Junction to Case |
27°C/W |
| Polarity |
Negative|Positive |
| Special Features |
Current Limit|Thermal Shutdown Protection |
| Load Regulation |
0.3%Vo(Typ) |
| Line Regulation |
0.092%Vo(Typ) |
| Maximum Dropout Voltage @ Current (V) |
0.45@1A |
| Minimum Input Voltage (V) |
3 |
| Maximum Input Voltage (V) |
36 |
| Output Voltage (V) |
1.4 to 20.5 |
| Typical Dropout Voltage @ Current (V) |
0.216@0.5A|0.307@1A |
| Accuracy (%) |
±1 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Ground Current @ Full Load (mA) |
6.1 |
| Typical PSRR (dB) |
78 |
| Typical Output Capacitance (uF) |
10(Min) |
| Typical Output Noise Voltage (uVrms) |
4.67 |
| Output Capacitor Type |
Ceramic |
|
|
PACKAGE INFO
|
| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
20 |
| Lead Shape |
No Lead |
| PCB |
20 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5 |
| Package Width (mm) |
5 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5 |
| Package Overall Width (mm) |
5 |
| Package Overall Height (mm) |
0.9 |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.31 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
0.95 |
| Minimum PACKAGE_DIMENSION_H |
0.8 |
| Maximum PACKAGE_DIMENSION_L |
5.15 |
| Minimum PACKAGE_DIMENSION_L |
4.85 |
| Maximum PACKAGE_DIMENSION_W |
5.15 |
| Minimum PACKAGE_DIMENSION_W |
4.85 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1 |
| Minimum Seated_Plane_Height |
0.8 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.03 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.55 |
| Terminal Thickness (mm) |
0.2 |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Voltage-Controlled Oscillators (VCO) |
| • Frequency Synthesizers |
| • Test and Measurement |
| • Instrumentation, Medical, and Audio |
| • RX, TX, and PA Circuitry |
| • Post DC-DC Converter Regulation and Ripple Filtering |
| • Base Stations and Telecom Infrastructure |
| • +12-V and +24-V Industrial Buses |
| |
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