TPS7A6601QDGNRQ1 Texas Instruments IC REG LIN POS ADJ 150MA 8MSOP

2024/08/19 224

CATALOG

China

Type	LDO
Number of Outputs	1
Maximum Output Current (A)	0.15
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Output Type	Adjustable
Output Voltage Range (V)	<1.8\|1.8 to 10
Junction to Ambient	63.4°C/W
Junction to Case	53°C/W
Polarity	Positive
Special Features	Short Circuit Protection\|Thermal Shutdown Protection
Load Regulation	20mV
Line Regulation	5mV
Maximum Quiescent Current (mA)	0.02
Maximum Dropout Voltage @ Current (V)	0.24@80mA\|0.45@150mA
Minimum Input Voltage (V)	4
Maximum Input Voltage (V)	40
Output Voltage (V)	1.5 to 5
Typical Quiescent Current (mA)	0.012
Typical Dropout Voltage @ Current (V)	0.18@80mA\|0.3@150mA
Accuracy (%)	±1
Supplier Temperature Grade	Automotive
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Typical PSRR (dB)	40
Typical Output Capacitance (uF)	2.2(Min)

Supplier Package	HVSSOP EP
Basic Package Type	Lead-Frame SMT
Pin Count	8
Lead Shape	Gull-wing
PCB	8
Tab	N/R
Pin Pitch (mm)	0.65
Package Length (mm)	3.1(Max)
Package Width (mm)	3.1(Max)
Package Height (mm)	0.95(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	3.1(Max)
Package Overall Width (mm)	5.05(Max)
Package Overall Height (mm)	1.1(Max)
Seated Plane Height (mm)	1.1(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Heat Sinked Very Thin Shrink Small Outline Package, Exposed Pad
Package Family Name	SO
Jedec	MO-187
Package Outline	Link to Datasheet
Maximum PACKAGE_DIMENSION_H	0.95
Minimum PACKAGE_DIMENSION_H	N/A
Maximum PACKAGE_DIMENSION_L	3.1
Minimum PACKAGE_DIMENSION_L	2.9
Maximum PACKAGE_DIMENSION_W	3.1
Minimum PACKAGE_DIMENSION_W	2.9
Maximum Diameter	N/R
Minimum Diameter	N/R
Maximum Seated_Plane_Height	1.1
Minimum Seated_Plane_Height	N/A

MSL	2
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	PdNiAg
Terminal Base Material	Cu Alloy