|
|
• Input Voltage as Low as 1.425 V
|
• 380 mV Dropout Maximum at 2 A
|
• Adjustable Output from 0.5 V
|
| • Protections: Current Limit and Thermal Shutdown |
| • Very low leakage current: 150 nA max. |
| • 1-µA Quiescent Current in Shutdown Mode |
| • Full Industrial Temperature Range |
| • Available in SO-8, Fully RoHS-Compliant Package |
| |
| CATALOG |
| TPS7A7001DDAR COUNTRY OF ORIGIN |
TPS7A7001DDAR PARAMETRIC INFO
|
TPS7A7001DDAR PACKAGE INFO
|
TPS7A7001DDAR MANUFACTURING INFO
|
TPS7A7001DDAR PACKAGING INFO
|
TPS7A7001DDAR EACD MODELS
|
| TPS7A7001DDAR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Mexico |
| Philippines |
|
PARAMETRIC INFO
|
| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Regulation Condition Change In Load |
1.99A |
| Output Type |
Adjustable |
| Output Voltage Range (V) |
<1.8|1.8 to 10 |
| Junction to Ambient |
46.4°C/W |
| Junction to Case |
54.2°C/W |
| Polarity |
Positive |
| Special Features |
Current Limit|Thermal Shutdown Protection|Under Voltage Lockout |
| Load Regulation |
0.25%/A(Typ) |
| Line Regulation |
0.2%/V(Typ) |
| Maximum Dropout Voltage @ Current (V) |
0.2@1A|0.3@1.5A|0.38@2A |
| Minimum Input Voltage (V) |
1.425 |
| Maximum Input Voltage (V) |
6.5 |
| Output Voltage (V) |
0.9 to 5 |
| Typical Quiescent Current (mA) |
0.01 |
| Reference Voltage (V) |
0.5(Typ) |
| Accuracy (%) |
±3 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Ground Current @ Full Load (mA) |
3(Max) |
| Typical PSRR (dB) |
28 |
| Typical Output Capacitance (uF) |
4.7(Min) |
| Output Capacitor Type |
Ceramic |
|
|
PACKAGE INFO
|
| Supplier Package |
HSOIC EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.55(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.7(Max) |
| Seated Plane Height (mm) |
1.7(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Family Name |
SO |
| Jedec |
MS-012-BA |
| Package Outline |
Link to Datasheet |
|
| |
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
AuAg |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.8 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
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| APPLICATIONS |
| • Telecom and Networking Cards |
| • Motherboards and Peripheral Cards |
| • Industrial |
| • Wireless Infrastructure |
| • Set-Top Boxes |
| • Medical Equipment |
| • Notebook Computers |
| • Battery-Powered Systems |
| |
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