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• AEC-Q100 qualified for automotive applications:– Temperature grade 1: –40°C to 125°C, TA
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• Maximum output current: 300 mA
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• 4-V to 40-V wide VIN input-voltage range with up t 45-V transients
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• Fixed 3.3-V and 5-V outputs
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• Maximum dropout voltage: 400 mV at 300 mA
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• Stable with output capacitor in wide range of capacitance (4.7 µF to 500 µF) and ESR (0.001 Ω to 20 Ω)
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• Configurable for window watchdog or standard watchdog
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• Open-to-closed window ratio configurable as 1:1 or 8:1
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| CATALOG |
TPS7B6333QPWPRQ1 COUNTRY OF ORIGIN
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TPS7B6333QPWPRQ1 PARAMETRIC INFO
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TPS7B6333QPWPRQ1 PACKAGE INFO
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TPS7B6333QPWPRQ1 MANUFACTURING INFO
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TPS7B6333QPWPRQ1 PACKAGING INFO
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TPS7B6333QPWPRQ1 ECAD MODELS
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TPS7B6333QPWPRQ1 APPLICATIONS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
0.3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Output Type |
Fixed |
| Output Voltage Range (V) |
1.8 to 10 |
| Junction to Ambient |
39.7°C/W |
| Junction to Case |
28.9°C/W |
| Polarity |
Positive |
| Special Features |
Over Current Protection|Short Circuit Protection|Thermal Shutdown Protection |
| Load Regulation |
20mV |
| Line Regulation |
10mV |
| Maximum Quiescent Current (mA) |
0.098 |
| Maximum Dropout Voltage @ Current (V) |
0.4@300mA|0.325@200mA |
| Minimum Input Voltage (V) |
4 |
| Maximum Input Voltage (V) |
40 |
| Output Voltage (V) |
3.3 |
| Typical Quiescent Current (mA) |
0.078 |
| Typical Dropout Voltage @ Current (V) |
0.3@300mA|0.17@200mA |
| Accuracy (%) |
±2 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Output Capacitance (uF) |
4.7(Min) |
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PACKAGE INFO
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| Supplier Package |
HTSSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
MO-153 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Automotive MCU power supplies
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• Body control modules (BCM)
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• Seat comfort modules
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• EV and HEV battery management systems (BMS)
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• Electronic gear shifters
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• Transmissions
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| • Electrical power steering (EPS) |
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