|
|
• 3.0-mm x 2.8-mm x 1.5-mm MicroSiP™ Package
|
• 3.0-V to 17-V Input Range
|
• 1-A Continuous Output Current
|
| • DCS-Control™ Topology
|
| • Power Save Mode for Light Load Efficiency |
| • 20-µA Operating Quiescent Current |
| • 0.9-V to 6-V Adjustable Output Voltage |
| • 100% Duty Cycle for Lowest Dropout |
| • Power Good Output |
| • Programmable Soft Startup with Tracking |
| • Thermal Shutdown Protection |
| • Pin to Pin compatible with TPS82130 and TPS82140 |
| |
| CATALOG |
| TPS82150SILR COUNTRY OF ORIGIN |
TPS82150SILR PARAMETRIC INFO
|
TPS82150SILR PACKAGE INFO
|
TPS82150SILR MANUFACTURING INFO
|
TPS82150SILR PACKAGING INFO
|
TPS82150SILR EACD MODELS
|
| TPS82150SILR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Philippines |
| Taiwan (Province of China) |
| China |
|
PARAMETRIC INFO
|
| type |
Step Down |
| Number of Outputs |
1 |
| Output Voltage (V) |
0.9 to 6 |
| Maximum Output Current (A) |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Tradename |
MicroSiP™ |
| Switching Regulator |
yes |
| Minimum Input Voltage (V) |
3 |
| Maximum Input Voltage (V) |
17 |
| Output Type |
Adjustable |
| Load Regulation |
0.12%/A(Typ) |
| Line Regulation |
0.002%/V(Typ) |
| Switching Frequency (kHz) |
2000(Typ) |
| Typical Standby Current (mA) |
0.0015 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
| On/Off Logic |
Positive |
|
|
PACKAGE INFO
|
| Supplier packaging |
uSIP SMD EP |
| Basic package type |
Non-Lead-Frame SMT |
| Number of pins |
8 |
| Pin shape |
No Lead |
| PCB |
8 |
| ears |
N/R |
| Pin spacing (mm) |
0.65 |
| Package length (mm) |
3.1(Max) |
| Package width (mm) |
2.9(Max) |
| Package height (mm) |
1.53(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
2.9(Max) |
| Package Overall Height (mm) |
1.53(Max) |
| Mounting surface height (mm) |
1.53(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Micro System In Package, Exposed Pad |
| Package series name |
SIP |
| JEDEC |
not applicable |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Au |
| Plating materials |
Ni |
| Terminal Base Material |
not applicable |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Package |
Tape and reel packaging |
| Packing quantity |
3000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| packaging type file |
Link to datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • Industrial Applications |
| • Telecom and Networking Applications |
| • Solid State Drives |
| • Inverting Power Supply |
| |
One-stop supplier of IC products