
|
|
• Low ON-State Resistance (Ron)– 0.9-Ω Max (3-V Supply) – 1.5-Ω Max (1.8-V Supply)
|
• 0.4-Ω Max Ron Flatness (3-V Supply)
|
• 1.6-V to 3.6-V Single-Supply Operation
|
| • Available in SOT-23 and VSSOP Packages
|
| • High Current-Handling Capacity (100 mA Continuous) |
| • 1.8-V CMOS Logic Compatible (3-V Supply) |
| • Fast Switching: tON = 14 ns, tOFF = 9 ns |
|
| CATALOG |
| TS3A4741DCNR COUNTRY OF ORIGIN |
TS3A4741DCNR PARAMETRIC INFO
|
TS3A4741DCNR PACKAGE INFO
|
TS3A4741DCNR MANUFACTURING INFO
|
TS3A4741DCNR PACKAGING INFO
|
TS3A4741DCNR ECAD MODELS
|
| TS3A4741DCNR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Thailand |
China
|
|
PARAMETRIC INFO
|
| type |
Analog Switch |
| Number of Channels per Chip |
2 |
| Switch Architecture |
SPST |
| Polarity |
Non-Inverting |
| Maximum On Resistance Range (Ohm) |
1 to 5 |
| Configuration |
Dual SPST |
| Number of Inputs per Chip |
2 |
| Number of Outputs per Chip |
2 |
| Function |
General |
| Chip Enable Signals |
yes |
| Maximum On Resistance (Ohm) |
1.5@1.8V |
| Maximum Turn-On Time (ns) |
18@1.95V |
| Maximum Turn-Off Time (ns) |
10@1.95V |
| Input Signal Type |
Single |
| Output Signal Type |
Single |
| Maximum Low Level Output Current (mA) |
100 |
| Maximum High Level Output Current (mA) |
100 |
| Maximum Frequency (25°C) @ Vcc (MHz) |
125(Typ)@3.6V|123(Typ)@1.95V |
| Switch Control Logic |
Active High |
| Switch Normal Position |
NO |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Power Supply Type |
Single |
| Minimum Single Supply Voltage (V) |
1.65 |
| Typical Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
3.6 |
| Maximum Supply Current (mA) |
0.000075@3.6V |
|
|
PACKAGE INFO
|
| Supplier packaging |
SOT-23 |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
8 |
| Pin shape |
Gull-wing |
| PCB |
8 |
| ears |
N/R |
| Package length (mm) |
3(Max) |
| Package width (mm) |
1.75(Max) |
| Package height (mm) |
1.3(Max) |
| Package diameter (mm) |
N/R |
| Install |
Surface Mount |
| Packaging materials |
Plastic |
| package instruction |
Small Outline Transistor |
| Package series name |
SOT |
| Package outline |
Link to datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Au |
| Plating materials |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Package |
Tape and reel packaging |
| Packing quantity |
3000 |
| packaging type file |
Link to datasheet |
|
|
ECAD MODELS
|

|
|
APPLICATIONS
|
• Power Routing
|
| • Battery-Powered Systems |
| • Audio and Video Signal Routing |
| • Low-Voltage Data-Acquisition Systems |
| • Communications Circuits |
| • PCMCIA Cards |
| • Cellular Phones |
| • Modems |
| • Hard Drives |
| |
| |