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• Low ON-State Resistance (Ron)– 0.9-Ω Max (3-V Supply) – 1.5-Ω Max (1.8-V Supply)
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• 0.4-Ω Max Ron Flatness (3-V Supply)
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• 1.6-V to 3.6-V Single-Supply Operation
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• Available in SOT-23 and VSSOP Packages
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• High Current-Handling Capacity (100 mA Continuous) |
• 1.8-V CMOS Logic Compatible (3-V Supply) |
• Fast Switching: tON = 14 ns, tOFF = 9 ns |
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CATALOG |
TS3A4741DCNR COUNTRY OF ORIGIN |
TS3A4741DCNR PARAMETRIC INFO
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TS3A4741DCNR PACKAGE INFO
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TS3A4741DCNR MANUFACTURING INFO
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TS3A4741DCNR PACKAGING INFO
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TS3A4741DCNR ECAD MODELS
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TS3A4741DCNR APPLICATIONS |
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COUNTRY OF ORIGIN |
Thailand |
China
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PARAMETRIC INFO
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type |
Analog Switch |
Number of Channels per Chip |
2 |
Switch Architecture |
SPST |
Polarity |
Non-Inverting |
Maximum On Resistance Range (Ohm) |
1 to 5 |
Configuration |
Dual SPST |
Number of Inputs per Chip |
2 |
Number of Outputs per Chip |
2 |
Function |
General |
Chip Enable Signals |
yes |
Maximum On Resistance (Ohm) |
1.5@1.8V |
Maximum Turn-On Time (ns) |
18@1.95V |
Maximum Turn-Off Time (ns) |
10@1.95V |
Input Signal Type |
Single |
Output Signal Type |
Single |
Maximum Low Level Output Current (mA) |
100 |
Maximum High Level Output Current (mA) |
100 |
Maximum Frequency (25°C) @ Vcc (MHz) |
125(Typ)@3.6V|123(Typ)@1.95V |
Switch Control Logic |
Active High |
Switch Normal Position |
NO |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Power Supply Type |
Single |
Minimum Single Supply Voltage (V) |
1.65 |
Typical Single Supply Voltage (V) |
3 |
Maximum Single Supply Voltage (V) |
3.6 |
Maximum Supply Current (mA) |
0.000075@3.6V |
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PACKAGE INFO
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Supplier packaging |
SOT-23 |
Basic package type |
Lead-Frame SMT |
Number of pins |
8 |
Pin shape |
Gull-wing |
PCB |
8 |
ears |
N/R |
Package length (mm) |
3(Max) |
Package width (mm) |
1.75(Max) |
Package height (mm) |
1.3(Max) |
Package diameter (mm) |
N/R |
Install |
Surface Mount |
Packaging materials |
Plastic |
package instruction |
Small Outline Transistor |
Package series name |
SOT |
Package outline |
Link to datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum reflow temperature (°C) |
260 |
Reflow soldering time (seconds) |
30 |
Number of reflow cycles |
3 |
standard |
J-STD-020D |
Reflow temperature source |
Link to datasheet |
Maximum wave soldering temperature (°C) |
N/R |
Wave soldering time (seconds) |
N/R |
Lead Finish(Plating) |
Au |
Plating materials |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
R |
Package |
Tape and reel packaging |
Packing quantity |
3000 |
packaging type file |
Link to datasheet |
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ECAD MODELS
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APPLICATIONS
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• Power Routing
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• Battery-Powered Systems |
• Audio and Video Signal Routing |
• Low-Voltage Data-Acquisition Systems |
• Communications Circuits |
• PCMCIA Cards |
• Cellular Phones |
• Modems |
• Hard Drives |
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