TS922AIDT STMicroelectronics IC OPAMP GP 4MHZ RRO 8SO

label:
2024/04/8 254



• Rail-to-rail input and output
• Low noise: 9 nV/√Hz
• Low distortion
• High output current: 80 mA (able to drive 32 Ω loads)
• High-speed: 4 MHz, 1 V/μs
• Operating from 2.7 to 12 V
•  Low input offset voltage: 900 μV max. (TS922A)
• ESD internal protection: 2 kV
• Latch-up immunity
CATALOG
TS922AIDT COUNTRY OF ORIGIN
TS922AIDT PARAMETRIC INFO
TS922AIDT PACKAGE INFO
TS922AIDT MANUFACTURING INFO
TS922AIDT PACKAGING INFO
TS922AIDT EACD MODELS
TS922AIDT APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
Philippines
China
Thailand
Morocco



PARAMETRIC INFO
Manufacturer Type General Purpose Amplifier
type General Purpose Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 2.7
Number of Channels per Chip 2
Process Technology BiCMOS
Typical Single Supply Voltage (V) 3|5|9
Maximum Single Supply Voltage (V) 12
Maximum Quiescent Current (mA) 3@5V
Typical Gain Bandwidth Product (MHz) 4
Maximum Input Offset Voltage (mV) 0.9@5V
Maximum Input Offset Current (uA) 0.03@5V
Maximum Operating Supply Voltage (V) 12
Maximum Input Bias Current (uA) 0.1@5V
Minimum CMRR (dB) 60
Maximum Supply Voltage Range (V) 12 to 12.5
Minimum CMRR Range (dB) 60 to 65
Typical Voltage Gain (dB) 106.02
Typical Slew Rate (V/us) 1.3@5V
Typical Output Current (mA) 80
Typical Input Noise Voltage Density (nV/rtHz) 9@5V
Shut Down Support no
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single


PACKAGE INFO
Supplier packaging SO N
Basic package type Lead-Frame SMT
Number of pins 8
Pin shape Gull-wing
PCB 8
ears N/R
Pin spacing (mm) 1.27
Package length (mm) 5(Max)
Package width (mm) 4(Max)
Package height (mm) 1.65(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Mounting surface height (mm) 1.75(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Small Outline IC Narrow Body
Package series name SO
JEDEC MS-012AA
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
standard IPC-1752
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Wave soldering temperature source Link to datasheet
Lead Finish(Plating) Au
Plating materials Pd over Ni
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles N/R


PACKAGING INFO
Package Tape and reel packaging
Packing quantity 1000


ECAD MODELS



APPLICATIONS
• Industrial Process Control
• Multiplexed Data Acquisition Systems
• High Speed Data Acquisition for PCs
• Digital Signal Processing
Продукт RFQ