TSV991AILT STMicroelectronics IC OPAMP GP 20MHZ RRO SOT23-5

label:
2024/05/24 269

• Low input offset voltage: 1.5 mV max. (A grade)
• Rail-to-rail input and output
• Wide bandwidth 20 MHz
• Stable for gain ≥ 4 or ≤ -3
• Low power consumption: 820 µA typ.
• High output current: 35 mA
• Operating from 2.5 V to 5.5 V
• Low input bias current, 1 pA typ.
• ESD internal protection ≥ 5 kV
CATALOG
TSV991AILT COUNTRY OF ORIGIN
TSV991AILT PARAMETRIC INFO
TSV991AILT PACKAGE INFO
TSV991AILT MANUFACTURING INFO
TSV991AILT PACKAGING INFO
TSV991AILT EACD MODELS
TSV991AILT APPLICATIONS



COUNTRY OF ORIGIN
China
Malaysia



PARAMETRIC INFO
Manufacturer Type Low Voltage Amplifier
Type Low Voltage Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 2.5
Number of Channels per Chip 1
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Output Type CMOS
Maximum Quiescent Current (mA) 1.1@5V
Typical Gain Bandwidth Product (MHz) 20
Maximum Input Offset Voltage (mV) 1.5@5V
Maximum Input Offset Current (uA) 0.00001@5V
Maximum Operating Supply Voltage (V) 5.5
Maximum Input Bias Current (uA) 0.00001@5V
Minimum CMRR (dB) 62
Maximum Supply Voltage Range (V) 5.5 to 6
Minimum CMRR Range (dB) 60 to 65
Typical Voltage Gain (dB) 91
Typical Slew Rate (V/us) 10@5V
Typical Output Current (mA) 35@5V
Typical Input Noise Voltage Density (nV/rtHz) 21@5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single



PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3(Max)
Package Width (mm) 1.75(Max)
Package Height (mm) 1.3(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.45(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178AA
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard IPC-1752
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 1000



ECAD MODELS




APPLICATIONS
• Battery-powered applications
• Portable devices
• Signal conditioning and active filtering
• Medical instrumentation
• Automotive applications
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