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• Low input offset voltage: 1.5 mV max. (A grade)
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• Rail-to-rail input and output
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• Wide bandwidth 20 MHz
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• Stable for gain ≥ 4 or ≤ -3 |
• Low power consumption: 820 µA typ. |
• High output current: 35 mA |
• Operating from 2.5 V to 5.5 V |
• Low input bias current, 1 pA typ. |
• ESD internal protection ≥ 5 kV |
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CATALOG |
TSV991AILT COUNTRY OF ORIGIN |
TSV991AILT PARAMETRIC INFO
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TSV991AILT PACKAGE INFO
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TSV991AILT MANUFACTURING INFO
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TSV991AILT PACKAGING INFO
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TSV991AILT EACD MODELS
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TSV991AILT APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Malaysia |
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PARAMETRIC INFO
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Manufacturer Type |
Low Voltage Amplifier |
Type |
Low Voltage Amplifier |
Rail to Rail |
Rail to Rail Input/Output |
Minimum Single Supply Voltage (V) |
2.5 |
Number of Channels per Chip |
1 |
Typical Single Supply Voltage (V) |
3|5 |
Maximum Single Supply Voltage (V) |
5.5 |
Output Type |
CMOS |
Maximum Quiescent Current (mA) |
1.1@5V |
Typical Gain Bandwidth Product (MHz) |
20 |
Maximum Input Offset Voltage (mV) |
1.5@5V |
Maximum Input Offset Current (uA) |
0.00001@5V |
Maximum Operating Supply Voltage (V) |
5.5 |
Maximum Input Bias Current (uA) |
0.00001@5V |
Minimum CMRR (dB) |
62 |
Maximum Supply Voltage Range (V) |
5.5 to 6 |
Minimum CMRR Range (dB) |
60 to 65 |
Typical Voltage Gain (dB) |
91 |
Typical Slew Rate (V/us) |
10@5V |
Typical Output Current (mA) |
35@5V |
Typical Input Noise Voltage Density (nV/rtHz) |
21@5V |
Shut Down Support |
No |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Power Supply Type |
Single |
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PACKAGE INFO
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Supplier Package |
SOT-23 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
5 |
Lead Shape |
Gull-wing |
PCB |
5 |
Tab |
N/R |
Pin Pitch (mm) |
0.95 |
Package Length (mm) |
3(Max) |
Package Width (mm) |
1.75(Max) |
Package Height (mm) |
1.3(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.45(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
MO-178AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
IPC-1752 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
2 Years |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
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ECAD MODELS
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APPLICATIONS |
• Battery-powered applications |
• Portable devices |
• Signal conditioning and active filtering |
• Medical instrumentation |
• Automotive applications |
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