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| CATALOG |
TSX-3225 25.0000MF10P-C PARAMETRIC INFO
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TSX-3225 25.0000MF10P-C PACKAGE INFO
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TSX-3225 25.0000MF10P-C MANUFACTURING INFO
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TSX-3225 25.0000MF10P-C PACKAGING INFO
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PARAMETRIC INFO
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| Type |
Crystal |
| Standard Frequency (MHz) |
25 |
| Frequency Tolerance (ppm) |
±10 |
| Frequency Stability (ppm) |
±10 |
| Load Capacitance (pF) |
18 |
| Mode of Oscillation |
Fundamental |
| Series Resistance (Ohm) |
40 |
| Minimum Operating Temperature (°C) |
-20 |
| Maximum Operating Temperature (°C) |
85 |
| Frequency Aging (ppm/Year) |
±1 (1st) |
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PACKAGE INFO
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| Supplier Package |
Mini-CSMD |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
4 |
| Lead Shape |
No Lead |
| PCB |
4 |
| Tab |
N/R |
| Pin Pitch (mm) |
2 |
| Package Length (mm) |
3.2 |
| Package Width (mm) |
2.5 |
| Package Height (mm) |
0.6(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.2 |
| Package Overall Width (mm) |
2.5 |
| Package Overall Height (mm) |
0.6(Max) |
| Seated Plane Height (mm) |
0.6(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
1 |
| Package Weight (g) |
N/A |
| Package Material |
Ceramic |
| Package Description |
Miniature Ceramic Surface Mount Device |
| Package Family Name |
N/A |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
2 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
NiCo |
| Terminal Base Material |
WMo |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Bulk |
| Quantity Of Packaging |
100 |
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