TSX922IYDT STMicroelectronics IC OPAMP R-R CMOS 10MHZ SO8

label:
2023/11/27 224



• Rail-to-rail input and output
• Wide supply voltage: 4 V - 16 V
• Gain bandwidth product: 10 MHz typ at 16 V
• Low power consumption: 2.8 mA typ per amplifier at 16 V
• Unity gain stable
• Low input bias current: 10 pA typ
• High tolerance to ESD: 4 kV HBM
• Extended temperature range: -40 °C to 125 °C
• Automotive qualification


CATALOG
TSX922IYDT COUNTRY OF ORIGIN
TSX922IYDT PARAMETRIC INFO
TSX922IYDT PACKAGE INFO
TSX922IYDT MANUFACTURING INFO
TSX922IYDT PACKAGING INFO
TSX922IYDT ECAD MODELS
TSX922IYDT APPLICATIONS


COUNTRY OF ORIGIN
Morocco


PARAMETRIC INFO
Manufacturer Type General Purpose Amplifier
Type General Purpose Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 4
Number of Channels per Chip 2
Process Technology CMOS
Typical Single Supply Voltage (V) 5|9|12|15
Maximum Single Supply Voltage (V) 16
Output Type CMOS
Maximum Quiescent Current (mA) 6.8@16V
Typical Gain Bandwidth Product (MHz) 10
Maximum Input Offset Voltage (mV) 5@16V
Maximum Input Offset Current (uA) 0.0001@16V
Maximum Operating Supply Voltage (V) 16
Maximum Input Bias Current (uA) 0.0001@16V
Minimum CMRR (dB) 67
Maximum Supply Voltage Range (V) 16 to 17
Minimum CMRR Range (dB) 65 to 70
Typical Voltage Gain (dB) 113
Typical Slew Rate (V/us) 16.2@16V
Typical Settling Time (ns) 245
Typical Output Current (mA) 74@16V
Typical Input Noise Voltage Density (nV/rtHz) 16.5@16V
Typical Input Bias Current (uA) 0.00001@16V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single


PACKAGE INFO
Supplier Package SO N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 4.9
Package Width (mm) 3.9
Package Height (mm) 1.25(Min)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Communications
• Process control
• Test equipment

Продукт RFQ