 |
|
| • Accepts NTSC (J, M, 4.43), PAL (B, D, G, H, I,M, N, Nc), and SECAM (B, D, G, K, K1, L) Video |
| • Supports ITU-R BT.601 Standard Sampling |
| • High-Speed 9-Bit Analog-to-Digital Converter(ADC) |
| • Two Composite Inputs or One S-Video Input |
| • Fully Differential CMOS Analog Preprocessing Channels With Clamping and Automatic GainControl (AGC) for Best Signal-to-Noise (S/N) Performance |
| • Ultralow Power Consumption |
| • 48-Terminal PBGA Package (ZQC) or 32-Terminal TQFP Package (PBS) |
| • Power-Down Mode: <1 mW |
| • Brightness, Saturation, Hue, and Sharpness Control Through I
2C |
| • Complementary 4-Line (3-H Delay) Adaptive Comb Filters for Both Cross-Luminance and Cross-Chrominance Noise Reduction |
| • Patented Architecture for Locking to Weak,Noisy, or Unstable Signals |
| • Single 27.000-MHz Crystal for All Standards |
| • Internal Phase-Locked Loop (PLL) for Line-Locked Clock and Sampling |
| • Subcarrier Genlock Output for Synchronizing Color Subcarrier of External Encoder |
| • Variable Digital I/O Supply Voltage Range from 1.8 V to 3.3 V |
|
| CATALOG |
| TVP5151IPBSR COUNTRY OF ORIGIN |
| TVP5151IPBSR PARAMETRIC INFO |
| TVP5151IPBSR PACKAGE INFO |
| TVP5151IPBSR MANUFACTURING INFO |
| TVP5151IPBSR PACKAGING INFO |
| TVP5151IPBSR ECAD MODELS |
| TVP5151IPBSR FUNCTIONAL BLOCK DIAGRAM |
| TVP5151IPBSR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
|
| PARAMETRIC INFO |
| Type |
Decoder |
| ADC/DAC Resolution (bit) |
9 |
| Standard Input Type |
NTSC|PAL|SECAM |
| Standard Output Type |
ITU-R BT.656 |
| Power Supply Type |
Analog|Digital |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Typical Operating Supply Voltage (V) |
1.8|3.3 |
| Maximum Operating Supply Voltage (V) |
1.95|3.6 |
| Typical Supply Current (mA) |
27.9|30 |
| Signal to Noise Ratio (dB) |
50 |
| Maximum Power Dissipation (mW) |
185 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
| |
| PACKAGE INFO |
| Supplier Package |
TQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
Gull-wing |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
5.05(Max) |
| Package Width (mm) |
5.05(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
7.1(Max) |
| Package Overall Width (mm) |
7.1(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026AAA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| The following is a partial list of suggested applications: |
| • Digital televisions |
| • PDAs |
| • Notebook PCs |
| • Cell phones |
| • Video recorder/players
|
| • Internet appliances/web pads
|
| • Handheld games |
| • Surveillance |
| • Portable navigation |
| • Portable video projectors |
|
One-stop supplier of IC products