|
|
• No direction-control signal needed
|
• Maximum data rates:– 110Mbps (push pull)– 1.2Mbps (open drain)
|
• 1.4V to 3.6V on A port and 1.65V to 5.5V on B port(VCCA ≤ VCCB)
|
• No power-supply sequencing required – either VCCA or VCCB can be ramped first
|
• Latch-up performance exceeds 100mA per JESD 78, class II
|
• ESD protection exceeds JESD 22 (A port):– 2000 V Human Body Model (A114-B)– 150 V Machine Model (A115-A)– 1000 V Charged-Device Model (C101)
|
• IEC 61000-4-2 ESD (B-port):– ± 8kV Contact Discharge– ± 6kV Air Discharge
|
|
| CATALOG |
TXS0108EPWR COUNTRY OF ORIGIN
|
TXS0108EPWR PARAMETRIC INFO
|
TXS0108EPWR PACKAGE INFO
|
TXS0108EPWR MANUFACTURING INFO
|
TXS0108EPWR PACKAGING INFO
|
TXS0108EPWR ECAD MODELS
|
TXS0108EPWR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
Taiwan (Province of China)
|
Malaysia
|
|
PARAMETRIC INFO
|
| Number of Channels |
8 |
| Channel Type |
Bidirectional |
| Logic Family |
TXS |
| Logic Function |
Voltage Level Translator |
| Output Type |
Open Drain|Push-Pull |
| Minimum High Level Input Voltage (V) |
1 |
| Minimum Latch-Up Current (mA) |
100 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Supply Voltage (V) |
1.4/1.65 |
| Maximum Operating Supply Voltage (V) |
3.6/5.5 |
| Maximum High Level Output Current (mA) |
-0.02 |
| Maximum Low Level Output Current (mA) |
0.62 |
| Maximum Quiescent Current (mA) |
0.003(Typ) |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
745@1.5V@1.8V |
| Maximum Supply Current (mA) |
0.008 |
| Absolute Propagation Delay Time (ns) |
745 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
20 |
| Lead Shape |
Gull-wing |
| PCB |
20 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
6.6(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6.6(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.3(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AC |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Handsets |
| • Smartphones |
| • Tablets |
| • Desktop PCs |
| |
One-stop supplier of IC products