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| CATALOG |
U.FL-R-SMT-1(80) COUNTRY OF ORIGIN
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U.FL-R-SMT-1(80) PARAMETRIC INFO
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U.FL-R-SMT-1(80) PACKAGE INFO
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U.FL-R-SMT-1(80) MANUFACTURING INFO
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U.FL-R-SMT-1(80) PACKAGING INFO
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U.FL-R-SMT-1(80) ECAD MODELS
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COUNTRY OF ORIGIN
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China
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Japan
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PARAMETRIC INFO
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| Type |
U.FL |
| Gender |
RCP |
| Operating Frequency (Hz) |
0 to 8G |
| Impedance (Ohm) |
50 |
| Termination Method |
Solder |
| Contact Plating |
Gold Over Nickel |
| Contact Gender |
M |
| Contact Material |
Brass |
| Terminate To |
PCB |
| Body Plating |
Silver |
| Body Material |
Phosphor Bronze |
| Insulator Material |
Liquid Crystal Polymer |
| Insulation Resistance (MOhm) |
500 |
| Polarity |
Reverse |
| Operating Temperature (°C) |
-40 to 105 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Mating Cycle (Cycles) |
30 |
| Minimum Storage Temperature (°C) |
-30 |
| Maximum Storage Temperature (°C) |
70 |
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PACKAGE INFO
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| Body Orientation |
Straight |
| Mounting |
Surface Mount |
| Product Length (mm) |
3 |
| Product Depth (mm) |
3.1 |
| Product Height (mm) |
1.25 |
| Product Diameter (mm) |
N/R |
| Product Weight (g) |
0.0157 |
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MANUFACTURING INFO
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| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
10 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
10000 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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