UCC5320ECDR Texas Instruments DGTL ISO 3KV 1CH GATE DRVR 8SOIC

label:

2024/02/28 373

• Feature options
– Split outputs (UCC53x0S)
– UVLO referenced to GND2 (UCC53x0E)
– Miller clamp option (UCC53x0M)

• 8-pin D (4mm creepage) andDWV (8.5mm creepage) package

• 60ns (typical) propagation delay

• 100kV/μs minimum CMTI

• Isolation barrier life > 40 Years

• 3V to 15V input supply voltage

• Up to 33V driver supply voltage
– 8V and 12V UVLO options

• Negative 5V handling capability on input pins

• Safety-related certifications:
– 7000VPK isolation DWV (planned) and 4242VPKisolation D per DIN V VDE V 0884-11:2017-01and DIN EN 61010-1
– 5000VRMS DWV and 3000VRMS Disolation rating for 1 minute per UL 1577
– CQC certification per GB4943.1-2011D and DWV (planned)

• CMOS inputs

• Operating temperature: –40°C to +125°C

CATALOG

UCC5320ECDR Parametric Info

UCC5320ECDR Package Info

UCC5320ECDR Manufacturing Info

UCC5320ECDR Packaging Info

UCC5320ECDR ECAD Models

UCC5320ECDR Functional Block Diagram

UCC5320ECDR Applications

PARAMETRIC INFO

Number of Drivers	1
Driver Configuration	Inverting\|Non-Inverting
Input Logic Compatibility	CMOS
Maximum Operating Supply Voltage (V)	15
Peak Output Current (A)	4.4(Typ)
Minimum Operating Temperature (°C)	-40
Type	IGBT\|GaNFET\|MOSFET\|SiCFET
Maximum Operating Temperature (°C)	125
Number of Outputs	1
Maximum Power Dissipation (mW)	1140
Minimum Operating Supply Voltage (V)	3
Maximum Supply Current (mA)	73
Absolute Propagation Delay Time (ns)	75
Maximum Propagation Delay Time (ns)	72
Maximum Rise Time (ns)	28
Maximum Fall Time (ns)	25
Latch-Up Proof	No
Special Features	Under Voltage Lockout
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150

PACKAGE INFO

Supplier Package	SOIC
Basic Package Type	Lead-Frame SMT
Pin Count	8
Lead Shape	Gull-wing
PCB	8
Tab	N/R
Pin Pitch (mm)	1.27
Package Length (mm)	5(Max)
Package Width (mm)	3.98(Max)
Package Height (mm)	1.5(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	5(Max)
Package Overall Width (mm)	6.19(Max)
Package Overall Height (mm)	1.75(Max)
Seated Plane Height (mm)	1.75(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Small Outline IC
Package Family Name	SO
Jedec	MS-012AA

Manufacturing Info

MSL	2
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy

PACKAGING INFO

Packaging Suffix	R
Packaging	Tape and Reel
Quantity Of Packaging	2500
Reel Diameter (in)	13
Reel Width (mm)	12.4
Tape Pitch (mm)	8
Tape Width (mm)	12
Component Orientation	Q1
Packaging Document	Link to Datasheet

ECAD MODELS

FUNCTIONAL BLOCK DIAGRAM

APPLICATIONS

• Motor drives

• High voltage DC-to-DC converters

• UPS and PSU

• HEV and EV power modules

• Solar inverters