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• Seven Darlingtons per package
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• Output current 500 mA per driver (600 mA peak)
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• Output voltage 50 V
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| • Integrated suppression diodes for inductive loads |
| • Outputs can be paralleled for higher current |
| • TTL/CMOS/PMOS/DTL compatible inputs |
| • Input pins placed opposite to output pins to simplify layout |
| |
| CATALOG |
| ULN2003D1013TR COUNTRY OF ORIGIN |
ULN2003D1013TR PARAMETRIC INFO
|
ULN2003D1013TR PACKAGE INFO
|
ULN2003D1013TR MANUFACTURING INFO
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ULN2003D1013TR PACKAGING INFO
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ULN2003D1013TR EACD MODELS
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|
| COUNTRY OF ORIGIN |
| Malaysia |
| China |
|
PARAMETRIC INFO
|
| Type |
NPN |
| Configuration |
Array 7 |
| Maximum Collector-Emitter Voltage (V) |
50 |
| Maximum Emitter Base Voltage (V) |
30 |
| Maximum Continuous DC Collector Current (A) |
0.5 |
| Operating Junction Temperature (°C) |
150 |
| Collector Current for VCE Saturation (mA) |
100|200|350 |
| Output Clamp Diode |
Yes |
| Maximum Clamp Diode Leakage Current (uA) |
50@50V |
| Maximum Clamp Diode Forward Voltage (V) |
2@350A |
| Maximum Input Current (mA) |
1.35@3.85V |
| Maximum Base Current (A) |
0.025 |
| Maximum Collector-Emitter Saturation Voltage (V) |
1.1@250uA@100mA|1.3@350uA@200mA|1.6@500uA@350mA |
| Maximum Collector-Emitter Cut-Off Current (mA) |
0.05 |
| Number of Elements per Chip |
7 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
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PACKAGE INFO
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| Supplier Package |
SO N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
10(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.6(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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