|
|
• 500-mA-Rated Collector Current
(Single Output)
|
• High-Voltage Outputs: 50 V
|
• Output Clamp Diodes
|
• Inputs Compatible With Various Types of Logic
|
|
| CATALOG |
ULN2803ADWR COUNTRY OF ORIGIN
|
ULN2803ADWR PARAMETRIC INFO
|
ULN2803ADWR PACKAGE INFO
|
ULN2803ADWR MANUFACTURING INFO
|
ULN2803ADWR PACKAGING INFO
|
ULN2803ADWR ECAD MODELS
|
ULN2803ADWR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Philippines
|
Malaysia
|
Thailand
|
|
PARAMETRIC INFO
|
| Type |
NPN |
| Configuration |
Octal Common Emitter |
| Maximum Collector-Emitter Voltage (V) |
50 |
| Maximum Emitter Base Voltage (V) |
30 |
| Maximum Continuous DC Collector Current (A) |
0.5 |
| Maximum Input Current (mA) |
1.35@3.85V |
| Output Clamp Diode |
Yes |
| Maximum Clamp Diode Leakage Current (uA) |
50@50V |
| Maximum Clamp Diode Forward Voltage (V) |
3@350mA |
| Operating Junction Temperature (°C) |
-65 to 150 |
| Maximum Collector-Emitter Saturation Voltage (V) |
1.1@250uA@100mA|1.3@350uA@200mA|1.6@500uA@350mA |
| Maximum Collector-Emitter Cut-Off Current (mA) |
0.05 |
| Number of Elements per Chip |
8 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
18 |
| Lead Shape |
Gull-wing |
| PCB |
18 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
11.75(Max) |
| Package Width (mm) |
7.6(Max) |
| Package Height (mm) |
2.35(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
11.75(Max) |
| Package Overall Width (mm) |
10.63(Max) |
| Package Overall Height (mm) |
2.65(Max) |
| Seated Plane Height (mm) |
2.65(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-013AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
24.4 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
24 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
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APPLICATIONS
|
• Relay Drivers
|
| • Hammer Drivers |
• Lamp Drivers
|
• Display Drivers (LED and Gas Discharge)
|
| •Line Drivers |
| •Logic Buffers |
•Stepper Motors
|
•IP Camera
|
•HVAC Valve and LED Dot Matrix
|
| |
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