|
|
• USB251xB/xBi products are fully footprint compatible with USB251x/xi/xA/xAi products as direct
drop-in replacements
— Cost savings include using the same PCB
components and application of USB-IF Compliance
by Similarity
|
• Full power management with individual or ganged
power control of each downstream port
|
• Fully integrated USB termination and pull-up/pulldown resistors
|
| • Supports a single external 3.3 V supply source;
internal regulators provide 1.2 V internal core voltage
|
| • Onboard 24 MHz crystal driver or external
24 MHz clock input |
| • Customizable vendor ID, product ID, and device
ID |
| • 4 kilovolts of HBM JESD22-A114F ESD protection
(powered and unpowered)
|
| • Supports self- or bus-powered operation
|
| • Supports the USB Battery Charging specification
Rev. 1.1 for Charging Downstream Ports (CDP) |
| • The USB251xB/xBi offers the following packages:
- 36-pin SQFN (6x6 mm) (Preferred)
- 36-pin QFN (6x6 mm) (Legacy) |
| • USB251xB products support the extended commercial temperature range of 0ºC to +85ºC |
|
| CATALOG |
| USB2513Bi-AEZG COUNTRY OF ORIGIN |
USB2513Bi-AEZG PARAMETRIC INFO
|
USB2513Bi-AEZG PACKAGE INFO
|
USB2513Bi-AEZG MANUFACTURING INFO
|
USB2513Bi-AEZG PACKAGING INFO
|
USB2513Bi-AEZG ECAD MODELS
|
| USB2513Bi-AEZG APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| United States of America |
| China |
| Singapore |
|
PARAMETRIC INFO
|
| Typical Supply Current (mA) |
40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-55 |
| Supplier Temperature Grade |
Industrial |
| Protocols Supported |
USB 2.0 |
| Interface Type |
Serial |
| Maximum Operating Frequency (MHz) |
24 |
| USB Speed Type |
Low Speed|Full Speed|High Speed |
| Type |
Hub Controller |
| USB Transceiver |
Yes |
|
|
PACKAGE INFO
|
| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
36 |
| Lead Shape |
No Lead |
| PCB |
36 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
6 |
| Package Width (mm) |
6 |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6 |
| Package Overall Width (mm) |
6 |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Quantity Of Packaging |
490 |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• LCD monitors and TVs
|
• Multi-function USB peripherals
|
• PC motherboards
|
| • Set-top boxes, DVD players, DVR/PVR |
| • Printers and scanners |
| • PC media drive bay |
| • Portable hub boxes |
| • Mobile PC docking |
| • Embedded systems |
| |
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