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• USB251xB/xBi products are fully footprint compatible with USB251x/xi/xA/xAi products as direct drop-in replacements— Cost savings include using the same PCB components and application of USB-IF Compliance by Similarity
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• Full power management with individual or ganged power control of each downstream port
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• Fully integrated USB termination and pull-up/pulldown resistors
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| • Supports a single external 3.3 V supply source;internal regulators provide 1.2 V internal core voltage
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| • Onboard 24 MHz crystal driver or external 24 MHz clock input |
| • Customizable vendor ID, product ID, and device ID |
| • 4 kilovolts of HBM JESD22-A114F ESD protection (powered and unpowered) |
| • Supports self- or bus-powered operation |
| • Supports the USB Battery Charging specification Rev. 1.1 for Charging Downstream Ports (CDP) |
| • The USB251xB/xBi offers the following packages:- 36-pin SQFN (6x6 mm) (Preferred)- 36-pin QFN (6x6 mm) (Legacy) |
| • USB251xBi products support the industrial temperature range of -40ºC to + |
| • USB251xB products support the extended commercial temperature range of 0ºC to + |
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| CATALOG |
| USB2514Bi-AEZG COUNTRY OF ORIGIN |
USB2514Bi-AEZG PARAMETRIC INFO
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USB2514Bi-AEZG PACKAGE INFO
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USB2514Bi-AEZG MANUFACTURING INFO
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USB2514Bi-AEZG PACKAGING INFO
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USB2514Bi-AEZG EACD MODELS
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| USB2514Bi-AEZG APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Singapore |
| China |
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PARAMETRIC INFO
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| Typical Supply Current (mA) |
45 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-55 |
| Supplier Temperature Rating |
Industrial |
| Protocols Supported |
USB 2.0 |
| Interface Type |
Serial |
| Maximum Operating Frequency (MHz) |
twenty four |
| USB Speed Type |
Low Speed|Full Speed|High Speed |
| type |
Hub Controller |
| USB Transceiver |
yes |
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PACKAGE INFO
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| Supplier packaging |
VQF |
| Basic package type |
Non-Lead-Frame SMT |
| Number of pins |
36 |
| Pin shape |
No Lead |
| PCB |
36 |
| ears |
N/R |
| Pin spacing (mm) |
0.5 |
| Package length (mm) |
6 |
| Package width (mm) |
6 |
| Package height (mm) |
0.95(Max) |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
1(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package series name |
QFN |
| JEDEC |
not applicable |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
20 to 40 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020C |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
not applicable |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Package |
Tape and reel packaging |
| Packing quantity |
3000 |
| Reel Diameter (in) |
7.05 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| packaging type file |
Link to datasheet |
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ECAD MODELS
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APPLICATIONS
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• LCD monitors and TVs
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| • Multi-function USB peripherals |
| • PC motherboards |
| • Set-top boxes, DVD players, DVR/PVR |
| • Printers and scanners |
| • MPC media drive bay |
| • Portable hub boxes |
| • Mobile PC docking |
| • Embedded systems |
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