|
|
• Integrated ESD protection circuits
- Up to ±15kV IEC Air Discharge without external devices
|
• Over-Voltage Protection circuit (OVP) protects the
VBUS pin from continuous DC voltages up to 30V
|
• Integrated USB Switch
- No degradation of Hi-Speed electrical characteristics
- Allows single USB port of connection by providing switching function for:
–Battery charging
–Stereo and mono/mic audio
–USB Full-Speed/Low-Speed data
|
| • flexPWR® Technology
- Low current design ideal for battery powered
applications
- “Sleep” mode tri-states all ULPI pins and
places the part in a low current state
- 1.8V to 3.3V IO Voltage (±10%)
|
| • Integrated battery to 3.3V regulator
- 2.2uF bypass capacitor
- 100mV dropout voltage |
| • “Wrapper-less” design for optimal timing performance and design ease
- Low Latency Hi-Speed Receiver (43 HiSpeed clocks Max) allows use of legacy
UTMI Links with a ULPI bridge |
| • Selectable Reference Clock Frequency
- Frequencies: 12, 13, 19.2, 24, 26, 27, 38.4,
52 or 60MHz - pin selectable
|
| • External Reference Clock operation available
- ULPI Input Clock Mode (60MHz sourced by
Link)
- 0 to 3.6V input drive tolerant
- Able to accept “noisy” clock sources as reference to internal, low-jitter PLL
|
| • Internal Oscillator operation available |
| • This mode requires external Quartz Crystal or
Ceramic Resonator |
| • Smart detection circuits allow identification of
USB charger, headset, or data cable insertion |
| • Includes full support for the optional On-The-Go
(OTG) protocol detailed in the On-The-Go Supplement Revision 2.0 specification |
| • Supports Headset Audio Mode |
|
| CATALOG |
| USB3320C-EZK-TR COUNTRY OF ORIGIN |
USB3320C-EZK-TR PARAMETRIC INFO
|
USB3320C-EZK-TR PACKAGE INFO
|
USB3320C-EZK-TR MANUFACTURING INFO
|
USB3320C-EZK-TR PACKAGING INFO
|
USB3320C-EZK-TR ECAD MODELS
|
USB3320C-EZK-TR APPLICATIONS
|
|
| COUNTRY OF ORIGIN |
| China |
|
PARAMETRIC INFO
|
| Number of Transceivers |
1 |
| Protocols Supported |
OTG|USB 2.0 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
| Power Supply Type |
Dual |
| Typical Dual Supply Voltage (V) |
1.8|3.3 |
| Minimum Dual Supply Voltage (V) |
1.6|3 |
| Maximum Dual Supply Voltage (V) |
2|3.6 |
|
|
PACKAGE INFO
|
| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
No Lead |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
5 |
| Package Width (mm) |
5 |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
5000 |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Networking
|
• Audio Video
|
| • Medical
|
| • Industrial Computers
|
• Printers
|
| • Repeaters |
| • Communication |
| |
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