|
|
• 2 data-line protection
|
• Protects VBUS
|
• Very low capacitance: 3.5 pF max
|
| • Very low leakage current: 150 nA max. |
| • SOT-666 and SOT23-6L packages |
| • RoHS compliant |
| |
| CATALOG |
| USBLC6-2SC6 COUNTRY OF ORIGIN |
USBLC6-2SC6 PARAMETRIC INFO
|
USBLC6-2SC6 PACKAGE INFO
|
USBLC6-2SC6 MANUFACTURING INFO
|
USBLC6-2SC6 PACKAGING INFO
|
USBLC6-2SC6 EACD MODELS
|
| USBLC6-2SC6 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
|
PARAMETRIC INFO
|
| Type |
Diode Array |
| Direction Type |
Uni-Directional |
| Maximum Working Voltage (V) |
5.25 |
| Configuration |
Dual |
| Capacitance Value (pF) |
3.5 |
| Maximum Clamping Voltage (V) |
17@8/20us |
| Maximum Leakage Current (uA) |
0.15 |
| Operating Junction Temperature (°C) |
-40 to 150 |
| Number of Elements per Chip |
2 |
| Test Current (mA) |
1 |
| Maximum Peak Pulse Current (A) |
5@8/20us |
| Minimum Breakdown Voltage (V) |
6 |
| Minimum Operating Temperature (°C) |
-40 |
| Fail Safe Protection |
No |
| Maximum Operating Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Supplier Temperature Grade |
Industrial |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3(Max) |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
1.3(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.45(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
0.02 |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178AA |
| Package Outline |
Link to Datasheet |
|
| |
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7.09(Max) |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q4 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • USB 2.0 ports up to 480 Mb/s (high speed) |
| • Compatible with USB 1.1 low and full speed |
| • Ethernet port: 10/100 Mb/s |
| • SIM card protection |
| • Video line protection |
| • Portable electronics |
| |
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