
|
|
• Very low profile - typical height of 1.1 mm
|
• Ideal for automated placement
|
• Trench MOS Schottky technology
|
• Low forward voltage drop, low power losses
|
• High efficiency operation
|
• Meets MSL level 1, per J-STD-020,LF maximum peak of 260 °C
|
• AEC-Q101 qualified available- Automotive ordering code; base P/NHM3
|
|
CATALOG |
V10P10HM3_A/H COUNTRY OF ORIGIN
|
V10P10HM3_A/H PARAMETRIC INFO
|
V10P10HM3_A/H PACKAGE INFO
|
V10P10HM3_A/H PACKAGING INFO
|
V10P10HM3_A/H ECAD MODELS
|
V10P10HM3_A/H APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
Type |
Schottky Diode |
Configuration |
Single Dual Anode |
Peak Reverse Repetitive Voltage (V) |
100 |
Maximum DC Reverse Voltage (V) |
100 |
Maximum Continuous Forward Current (A) |
10 |
Maximum Junction Ambient Thermal Resistance |
60°C/W(Typ) |
Peak Forward Voltage (V) |
0.68 |
Peak Non-Repetitive Surge Current (A) |
180 |
Peak Reverse Current (uA) |
150 |
Operating Junction Temperature (°C) |
-40 to 150 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
150 |
Supplier Temperature Grade |
Automotive |
Tradename |
eSMP® |
|
|
PACKAGE INFO
|
Supplier Package |
SMPC |
Pin Count |
3 |
PCB |
2 |
Tab |
Tab |
Pin Pitch (mm) |
2.13 |
Package Length (mm) |
4.35(Max) |
Package Width (mm) |
6.15(Max) |
Package Height (mm) |
1.2(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
4.75(Max) |
Package Overall Width (mm) |
6.65(Max) |
Package Overall Height (mm) |
1.2(Max) |
Seated Plane Height (mm) |
1.2(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Outline |
Link to Datasheet |
|
|
PACKAGING INFO
|
Packaging Suffix |
_A/ |
Packaging |
Tape and Reel |
Quantity Of Packaging |
1500 |
Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|

|
|
APPLICATIONS
|
For use in low voltage high frequency inverters,
freewheeling, DC/DC converters, and polarity protection
applications.
|
|