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• General features– Inrush current active management by power limitation– Very low stand-by current– 3.0 V CMOS compatible input– Optimized electromagnetic emission– Very low electromagnetic susceptibility– In compliance with the 2002/95/EC european directive
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• Diagnostic functions– Proportional load current sense– High current sense precision for wide range currents– Current sense disable– Thermal shutdown indication– Very low current sense leakage
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• Protections– Undervoltage shutdown– Overvoltage clamp– Load current limitation– Self limiting of fast thermal transients– Protection against loss of ground and loss of VCC– Thermal shutdown
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| CATALOG |
VN5012AKTR-E COUNTRY OF ORIGIN
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VN5012AKTR-E PARAMETER INFORMATION
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VN5012AKTR-E PACKAGING INFORMATION
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VN5012AKTR-E MANUFACTURING INFORMATION
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VN5012AKTR-E PACKAGING INFORMATION
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VN5012AKTR-E ECAD MODELS
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VN5012AKTR-E APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETER INFORMATION
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| Number of Outputs |
1 |
| Number of Inputs |
1 |
| Maximum Output Current (A) |
90 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Switch On Resistance (mOhm) |
16(Max) |
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PACKAGING INFORMATION
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| Supplier Packaging |
PowerSSO EP |
| Basic package types |
Lead-Frame SMT |
| Number of Pins |
twenty four |
| Pin shape |
Gull-wing |
| PCB |
twenty four |
| Ear piece |
N/R |
| Pin spacing (mm) |
0.8 |
| Package length (mm) |
10.5(Max) |
| Package width (mm) |
7.6(Max) |
| Package height (mm) |
2.35(Max) |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
2.45(Max) |
| Install |
Surface Mount |
| Packaging materials |
Plastic |
| package instruction |
Power Shrink Small Outline Package, Exposed Pad |
| Package Series Name |
SO |
| JEDEC |
not applicable |
| Package Outline |
Link to data sheet |
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MANUFACTURING INFORMATION
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| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Reflow cycles |
3 |
| Reflow temperature source |
Link to data sheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
not applicable |
| Terminal base material |
Cu Alloy |
| Shelf Life Period |
2 Years |
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| PACKAGING INFORMATION |
| Packaging Suffix |
TR |
| Package |
Tape and Reel Packaging |
| Packing quantity |
1000 |
| Package Type File |
Link to data sheet |
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| ECAD MODELS |
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| APPLICATIONS |
| • All types of resistive, inductive and capacitive loads |
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