VN5016AJTR-E STMicroelectronics IC DVR 1CH HISID AUTO POWERSSO12

label:

2023/10/17 444

■ Main features
– Inrush current active management by power limitation
– Very low stand-by current
– 3.0V CMOS compatible input
– Optimized electromagnetic emission
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC european directive

■ Diagnostic functions
– Proportional load current sense
– High current sense precision for wide range currents
– Current sense disable
– Thermal shutdown indication
– Very low current sense leakage

■ Protection
– Undervoltage shut-down
– Overvoltage clamp
– Load current limitation
– Self limiting of fast thermal transients
– Protection against loss of ground and loss of VCC
– Thermal shut down
– Reverse battery protection
– Electrostatic discharge protection

CATALOG

VN5016AJTR-E COUNTRY OF ORIGIN

VN5016AJTR-E PARAMETRIC INFO

VN5016AJTR-E PACKAGE INFO

VN5016AJTR-E MANUFACTURING INFO

VN5016AJTR-E PACKAGING INFO

VN5016AJTR-E ECAD MODELS

VN5016AJTR-E FUMCTONAL BLOCK DIAGRAM

VN5016AJTR-E APPLICATION

COUNTRY OF ORIGIN

China

Japan

Malta

Morocco

PARAMETRIC INFO

Number of Outputs	1
Number of Inputs	1
Maximum Output Current (A)	91
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	150
Switch On Resistance (mOhm)	16(Max)
Minimum Storage Temperature (°C)	-55
Maximum Storage Temperature (°C)	150

PACKAGE INFO

Supplier Package	PowerSSO EP
Basic Package Type	Lead-Frame SMT
Pin Count	12
Lead Shape	Gull-wing
PCB	12
Tab	N/R
Pin Pitch (mm)	0.8
Package Length (mm)	5(Max)
Package Width (mm)	4(Max)
Package Height (mm)	1.65(Max)
Package Diameter (mm)	N/R
Mounting	Surface Mount
Package Material	Plastic
Package Description	Power Shrink Small Outline Package, Exposed Pad
Package Family Name	SOP
Jedec	N/A

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	N/A
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	Ag
Terminal Base Material	Cu Alloy
Shelf Life Period	2 Years
Number of Wave Cycles	N/R

PACKAGING INFO

Packaging Suffix	TR
Packaging	Tape and Reel
Quantity Of Packaging	1000
Packaging Document	Link to Datasheet

ECAD MODELS

FUMCTONAL BLOCK DIAGRAM

APPLICATION

■ All types of resistive, inductive and capacitive loads