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• Main– In-rush current active management by power limitation– Very low standby current– 3.0V CMOS compatible input– Optimized electromagnetic emission– Very low electromagnetic susceptibility– In compliance with the 2002/95/EC European directive– Package: ECOPACK®
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• Diagnostic functionsDoc ID 12581– Proportional load current sense– High current sense precision for wide range currents– Current sense disable– Thermal shutdown indication– Very low current sense leakage
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• Protection– Undervoltage shut-down– Overvoltage clamp– Load current limitation– Self-limiting of fast thermal transients– Protection against loss of ground and loss of VCC– Thermal shutdown– Reverse battery protection (see Application schematic on page 21)
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| CATALOG |
| VND5025AKTR-E COUNTRY OF ORIGIN |
VND5025AKTR-E PARAMETRIC INFO
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VND5025AKTR-E PACKAGE INFO
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VND5025AKTR-E MANUFACTURING INFO
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VND5025AKTR-E PACKAGING INFO
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VND5025AKTR-E EACD MODELS
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| VND5025AKTR-E APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Malaysia |
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PARAMETRIC INFO
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| Number of Outputs |
2 |
| Number of Inputs |
2 |
| Maximum Output Current (A) |
57 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Switch On Resistance (mOhm) |
25(Max) |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
PowerSSO EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
Gull-wing |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.8 |
| Package Length (mm) |
10.5(Max) |
| Package Width (mm) |
7.6(Max) |
| Package Height (mm) |
2.35(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
2.45(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Power Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
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PACKAGING INFO
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| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • All types of resistive, inductive and capacitive loads |
| • Suitable as LED driver |
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