VND5T050AKTR-E STMicroelectronics IC DRIVER HIGH SIDE 2CH PWRSSO24

label:
2024/06/7 227




• AEC-Q100 qualified
• General– Very low standby current– 3.0 V CMOS compatible input– Optimized electromagnetic emission– Very low electromagnetic susceptibility
– Compliant with European directive 2002/95/EC– Fault reset standby pin (FR_Stby)
• Diagnostic functions– Proportional load current sense– High current sense precision for wide range currents– Off-state openload detection– Output short to VCC detection– Overload and short to ground latch-off– Thermal shutdown latch-off– Very low current sense leakage
•  Protections– Undervoltage shutdown– Overvoltage clamp– Load current limitation– Self limiting of fast thermal transients– Protection against loss of ground and loss of VCC– Thermal shutdown– Electrostatic discharge protection
CATALOG
VND5T050AKTR-E COUNTRY OF ORIGIN
VND5T050AKTR-E PARAMETRIC INFO
VND5T050AKTR-E PACKAGE INFO
VND5T050AKTR-E MANUFACTURING INFO
VND5T050AKTR-E PACKAGING INFO
VND5T050AKTR-E EACD MODELS
VND5T050AKTR-E APPLICATIONS



COUNTRY OF ORIGIN
Malaysia



PARAMETRIC INFO
Number of Outputs 2
Number of Inputs 2
Maximum Output Current (A) 46
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 150
Switch On Resistance (mOhm) 50
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150



PACKAGE INFO
Supplier Package PowerSSO EP
Basic Package Type Lead-Frame SMT
Pin Count 24
Lead Shape Gull-wing
PCB 24
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 10.5(Max)
Package Width (mm) 7.6(Max)
Package Height (mm) 2.4(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 2.47(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Power Shrink Small Outline Package, Exposed Pad
Package Family Name SO
Jedec N/A
Package Outline Link to Datasheet
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years



PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 1000
Packaging Document Link to Datasheet



ECAD MODELS




APPLICATIONS
• All types of resistive, inductive and capacitive loads
Продукт RFQ