|
|
• Automotive qualified
|
• Drain current: 25 A
|
• ESD protection
|
• Overvoltage clamp
|
• Thermal shutdown
|
• Current and power limitation
|
• Very low standby current
|
• Very low electromagnetic susceptibility
|
• Compliant with European directive 2002/95/EC
|
• Open drain status output
|
|
| CATALOG |
VNL5030JTR-E PARAMETRIC INFO
|
VNL5030JTR-E PACKAGE INFO
|
VNL5030JTR-E MANUFACTURING INFO
|
VNL5030JTR-E PACKAGING INFO
|
VNL5030JTR-E ECAD MODELS
|
|
PARAMETRIC INFO
|
| Number of Outputs |
1 |
| Number of Inputs |
1 |
| Maximum Output Current (A) |
25 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Switch On Resistance (mOhm) |
30(Max) |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
PowerSSO EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
12 |
| Lead Shape |
Gull-wing |
| PCB |
12 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.8 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.65(Max) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Power Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
One-stop supplier of IC products