W25N01GWZEIG Winbond IC FLASH 1GBIT SPI/QUAD 8WSON

label:
2025/07/2 11
W25N01GWZEIG Winbond 	IC FLASH 1GBIT SPI/QUAD 8WSON


CATALOG
W25N01GWZEIG COUNTRY OF ORIGIN
W25N01GWZEIG PARAMETRIC INFO
W25N01GWZEIG PACKAGE INFO
W25N01GWZEIG MANUFACTURING INFO
W25N01GWZEIG PACKAGING INFO


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Density (bit) 1G
Cell Type NAND
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Block Organization Symmetrical
Boot Block No
Timing Type Synchronous
Architecture Sectored
Maximum Access Time (ns) 8
Programmability Yes
Typical Operating Supply Voltage (V) 1.8
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 8
Number of Words 128M
Maximum Supply Current (mA) 35
Programming Voltage (V) 1.7 to 1.95
Sector Size 128Kbyte x 1024
Program Current (mA) 35
Address Width (bit) 32
Minimum Operating Supply Voltage (V) 1.7
Maximum Operating Supply Voltage (V) 1.95
Maximum Erase Time (s) 0.01/Block
Maximum Programming Time (ms) 0.7/Page
Command Compatible Yes
ECC Support Yes
Erase Suspend/Resume Modes Support No
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode No
Page Size 2Kbyte
Minimum Endurance (Cycles) 100000
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Density in Bits (bit) 1073741824


PACKAGE INFO
Supplier Package WSON EP
Pin Count 8
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 6
Package Width (mm) 8
Package Height (mm) 0.73
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.75
Mounting Surface Mount
Package Material Plastic
Package Family Name SON
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tube
Packaging Document Link to Datasheet


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