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• New Family of SpiFlash Memories
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• Highest Performance Serial Flash
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• Efficient “Continuous Read” and QPI Mode
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| • Low Power, Wide Temperature Range
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| • Flexible Architecture with 4KB sectors |
| • Advanced Security Features |
| • Space Efficient Packaging |
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| CATALOG |
| W25Q128FVSIG COUNTRY OF ORIGIN |
| W25Q128FVSIG LIFE CYCLE |
W25Q128FVSIG PARAMETRIC INFO
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W25Q128FVSIG PACKAGE INFO
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W25Q128FVSIG MANUFACTURING INFO
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W25Q128FVSIG PACKAGING INFO
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W25Q128FVSIG EACD MODELS
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| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
| China |
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| LIFE CYCLE |
| Obsolete Aug 10, 2017 |
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PARAMETRIC INFO
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| Density (bit) |
128M |
| Cell Type |
NOR |
| Interface Type |
Serial (SPI, Dual SPI, Quad SPI) |
| Block Organization |
Symmetrical |
| Boot Block |
no |
| Timing Type |
Synchronous |
| Architecture |
Sectored |
| Maximum Access Time (ns) |
7 |
| Typical Operating Supply Voltage (V) |
3|3.3 |
| Programmability |
yes |
| Tradename |
SpiFlash |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Rating |
Industrial |
| Number of Bits per Word (bit) |
8 |
| Number of Words |
16M |
| Maximum Operating Current (mA) |
20 |
| Programming Voltage (V) |
2.7 to 3.6 |
| Maximum Operating Frequency (MHz) |
104 |
| Sector Size |
4Kbyte x 4096 |
| Program Current (mA) |
25 |
| Address Bus Width (bit) |
twenty four |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Erase Time(s) |
200/Chip |
| Maximum Programming Time (ms) |
3/Page |
| Command Compatible |
yes |
| ECC Support |
no |
| Erase Suspend/Resume Modes Support |
yes |
| Simultaneous Read/Write Support |
no |
| Support of Common Flash Interface |
no |
| Support of Page Mode |
no |
| Page Size |
256byte |
| Minimum Endurance (Cycles) |
100000 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Density in Bits (bit) |
134217728 |
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PACKAGE INFO
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| Supplier packaging |
SOIC |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
8 |
| Pin shape |
Gull-wing |
| PCB |
8 |
| ears |
N/R |
| Pin spacing (mm) |
1.27 |
| Package length (mm) |
5.28 |
| Package width (mm) |
5.28 |
| Package height (mm) |
1.8 |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.28 |
| Package Overall Width (mm) |
7.9 |
| Package Overall Height (mm) |
1.95 |
| Mounting surface height (mm) |
1.95 |
| Install |
Surface Mount |
| Packaging materials |
Plastic |
| package instruction |
Small Outline IC |
| Package series name |
SO |
| JEDEC |
MS-012AA |
| Package outline |
Link to datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
20 to 40 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020C |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
not applicable |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Package |
Tube |
| packaging type file |
Link to datasheet |
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ECAD MODELS
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