W25Q128JWSIQ Winbond IC FLASH 128MBIT SPI/QUAD 8SOIC

label:
2025/11/24 10
W25Q128JWSIQ Winbond 	IC FLASH 128MBIT SPI/QUAD 8SOIC


CATALOG
W25Q128JWSIQ COUNTRY OF ORIGIN
W25Q128JWSIQ PARAMETRIC INFO
W25Q128JWSIQ PACKAGE INFO
W25Q128JWSIQ MANUFACTURING INFO
W25Q128JWSIQ PACKAGING INFO


COUNTRY OF ORIGIN
China
Taiwan (Province of China)


PARAMETRIC INFO
Density (bit) 128M
Cell Type NOR
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Block Organization Symmetrical
Boot Block No
Timing Type Synchronous
Architecture Sectored
Maximum Access Time (ns) 6
Programmability Yes
Typical Operating Supply Voltage (V) 1.8
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 8
Number of Words 16M
Maximum Supply Current (mA) 20
Programming Voltage (V) 1.7 to 1.95
Maximum Operating Frequency (MHz) 133
Sector Size 4Kbyte x 4096
Program Current (mA) 20
Address Width (bit) 24
Minimum Operating Supply Voltage (V) 1.7
Maximum Operating Supply Voltage (V) 1.95
Maximum Erase Time (s) 200/Chip
Maximum Programming Time (ms) 3/Page
Command Compatible Yes
ECC Support No
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode No
Page Size 256byte
Density in Bits (bit) 134217728


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5.28
Package Width (mm) 5.28
Package Height (mm) 1.8
Package Diameter (mm) N/R
Package Overall Length (mm) 5.28
Package Overall Width (mm) 7.9
Package Overall Height (mm) 1.95
Seated Plane Height (mm) 1.95
Mounting Surface Mount
Terminal Width (mm) 0.42
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Sn
Under Plating Material N/R
Terminal Base Material Cu Alloy
Shelf Life Period 12 Month
Shelf Life Condition 40°C+90 % RH
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 2000


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