W25Q64FWZPIG Winbond IC FLASH 64M SPI 104MHZ 8WSON

label:

2023/11/21 380

• New Family of SpiFlash Memories
– W25Q64FW: 64M-bit / 8M-byte
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– QPI: CLK, /CS, IO0, IO1, IO2, IO3
– Software & Hardware Reset

• Highest Performance Serial Flash
– 104MHz Single, Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– More than 100,000 erase/program cycles
– More than 20-year data retention

• Efficient “Continuous Read” and QPI Mode
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces instruction overhead
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash

• Low Power, Wide Temperature Range
– Single 1.65 to 1.95V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range

• Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume

• Advanced Security Features
– Software and Hardware Write-Protect
– Power Supply Lock-Down and OTP protection
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits

• Space Efficient Packaging
– 8-pin SOIC/VSOP 208-mil
– 8-pad WSON 6x5-mm, XSON 4x4-mm
– 16-ball WLCSP
– Contact Winbond for KGD and other options

CATALOG

W25Q64FWZPIG COUNTRY OF ORIGIN

W25Q64FWZPIG LIFECYCLE

W25Q64FWZPIG PARAMETRIC INFO

W25Q64FWZPIG PACKAGE INFO

W25Q64FWZPIG MANUFACTURING INFO

W25Q64FWZPIG PACKAGING INFO

W25Q64FWZPIG ECAD MODELS

COUNTRY OF ORIGIN

Taiwan (Province of China)

LIFECYCLE

Obsolete
Jul 01,2020

PARAMETRIC INFO

Density (bit)	64M
Cell Type	NOR
Interface Type	Serial (SPI, Dual SPI, Quad SPI)
Block Organization	Symmetrical
Boot Block	Yes
Timing Type	Synchronous
Architecture	Sectored
Maximum Access Time (ns)	6
Programmability	Yes
Typical Operating Supply Voltage (V)	1.8
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Industrial
Number of Bits per Word (bit)	8
Number of Words	8M
Location of Boot Block	Bottom\|Top
Maximum Operating Current (mA)	20
Programming Voltage (V)	1.65 to 1.95
Sector Size	4Kbyte x 2048
Program Current (mA)	25
Address Bus Width (bit)	24
Minimum Operating Supply Voltage (V)	1.65
Maximum Operating Supply Voltage (V)	1.95
Maximum Erase Time (s)	100/Chip
Maximum Programming Time (ms)	5/Page
Command Compatible	Yes
ECC Support	No
Erase Suspend/Resume Modes Support	Yes
Simultaneous Read/Write Support	No
Support of Common Flash Interface	No
Support of Page Mode	No
Page Size	256byte
Minimum Endurance (Cycles)	100000
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Density in Bits (bit)	67108864

PACKAGE INFO

Supplier Package	WSON EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	8
Lead Shape	No Lead
PCB	8
Tab	N/R
Pin Pitch (mm)	1.27
Package Length (mm)	5
Package Width (mm)	6
Package Height (mm)	0.73
Package Diameter (mm)	N/R
Package Overall Length (mm)	5
Package Overall Width (mm)	6
Package Overall Height (mm)	0.75
Seated Plane Height (mm)	0.75
Mounting	Surface Mount
Package Material	Plastic
Package Description	Very Very Thin Small Outline No Lead Package, Exposed Pad
Package Family Name	SON
Jedec	N/A

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	20 to 40
Number of Reflow Cycle	3
Standard	J-STD-020C
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	N/A
Shelf Life Period	168 Hours
Shelf Life Condition	30°C+Max RH of 60%
Number of Wave Cycles	N/R

PACKAGING INFO

Packaging	Tube
Packaging Document	Link to Datasheet

ECAD MODELS