W25Q64JVSSIQ Winbond IC FLASH 64M SPI 133MHZ 8SOIC

label:
2023/11/27 399



CATALOG
W25Q64JVSSIQ COUNTRY OF ORIGIN
W25Q64JVSSIQ PARAMETRIC INFO
W25Q64JVSSIQ PACKAGE INFO
W25Q64JVSSIQ MANUFACTURING INFO
W25Q64JVSSIQ PACKAGING INFO
W25Q64JVSSIQ ECAD MODELS


COUNTRY OF ORIGIN
China
Taiwan (Province of China)


PARAMETRIC INFO
Density (bit) 64M
Cell Type NOR
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Block Organization Symmetrical
Boot Block No
Timing Type Synchronous
Architecture Sectored
Maximum Access Time (ns) 6
Tradename SpiFlash
Programmability Yes
Typical Operating Supply Voltage (V) 3|3.3
Minimum Operating Temperature (°C) -40
I/O Mode Serial
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 8
Number of Words 8M
Maximum Operating Current (mA) 25
Programming Voltage (V) 2.7 to 3.6
Maximum Operating Frequency (MHz) 133
Sector Size 4Kbyte x 2048
Program Current (mA) 25
Address Bus Width (bit) 24
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 3.6
Maximum Erase Time (s) 100/Chip
Maximum Programming Time (ms) 3/Page
Command Compatible Yes
ECC Support No
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode No
Page Size 256byte
Minimum Endurance (Cycles) 100000
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Density in Bits (bit) 67108864
Process Technology 58nm


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5.28
Package Width (mm) 5.28
Package Height (mm) 1.8
Package Diameter (mm) N/R
Package Overall Length (mm) 5.28
Package Overall Width (mm) 7.9
Package Overall Height (mm) 1.95
Seated Plane Height (mm) 1.95
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tube
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ