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• Supports Hardwired TCP/IP Protocols : TCP, UDP, ICMP, IPv4, ARP, IGMP, PPPoE
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• Supports 8 independent sockets simultaneously
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• Supports Power down mode
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• Supports Wake on LAN over UDP
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• Supports High Speed Serial Peripheral Interface(SPI MODE 0, 3)
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• Internal 32Kbytes Memory for TX/RX Buffers
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• 10BaseT/100BaseTX Ethernet PHY embedded
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• Supports Auto Negotiation (Full and half duplex, 10 and 100-based )
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• Not supports IP Fragmentation
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• 3.3V operation with 5V I/O signal tolerance
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• LED outputs (Full/Half duplex, Link, Speed, Active)
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• 48 Pin LQFP Lead-Free Package (7x7mm, 0.5mm pitch)
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| CATALOG |
W5500 COUNTRY OF ORIGIN
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W5500 PARAMETRIC INFO
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W5500 PACKAGE INFO
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W5500 MANUFACTURING INFO
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W5500 PACKAGING INFO
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W5500 ECAD MODELS
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W5500 APPLICATIONS
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COUNTRY OF ORIGIN
|
Korea (Republic of)
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|
PARAMETRIC INFO
|
| Category |
Single Chip |
| Ethernet Speed (Mbps) |
10|100 |
| Physical Network Type |
10BASE-T|100BASE-TX |
| Auto-Negotiation |
Yes |
| DMA Support |
No |
| Communication Mode |
Full Duplex|Half Duplex |
| Host Interface |
SPI |
| Minimum Operating Supply Voltage (V) |
2.97 |
| Operating Supply Voltage (V) |
3.3 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.63 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Supply Current (mA) |
132(Typ) |
|
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PACKAGE INFO
|
| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
48 |
| Lead Shape |
Gull-wing |
| PCB |
48 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
7 |
| Package Width (mm) |
7 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
9 |
| Package Overall Width (mm) |
9 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BBC |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
60 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Ag |
| Under Plating Material |
Sn |
| Terminal Base Material |
C 194 |
| Number of Wave Cycles |
N/R |
|
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PACKAGING INFO
|
| Packaging |
Reel |
| Quantity Of Packaging |
2500 |
|
|
| ECAD MODELS |
 |
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| APPLICATIONS |
| • Home Network Devices: Set-Top Boxes, PVRs, Digital Media Adapters |
| • Serial-to-Ethernet: Access Controls, LED displays, Wireless AP relays, etc. |
| • Parallel-to-Ethernet: POS / Mini Printers, Copiers |
| • USB-to-Ethernet: Storage Devices, Network Printers |
| • GPIO-to-Ethernet: Home Network Sensors |
| • Security Systems: DVRs, Network Cameras, Kiosks |
| • Factory and Building Automations |
| • Medical Monitoring Equipment |
| • Embedded Servers |
| |
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