X0202MA 2BL2 STMicroelectronics SCR 1.25A 600V TO-92

2025/02/27 76

• On-state rms current, IT(RMS) 1.25 A

• Repetitive peak off-state voltage, VDRM/VRRM 600 or 800 V

• Triggering gate current, IGT (Q1) 50 to 200 µA

CATALOG

China

Philippines

Repetitive Peak Reverse Voltage (V)	600
Repetitive Peak Forward Blocking Voltage (V)	600
Rated Average On-State Current (A)	0.8
RMS On-State Current (A)	1.25
Surge Current Rating (A)	25
Maximum Holding Current (mA)	5
Peak On-State Voltage (V)	1.45@2.5A
Repetitive Peak Off-State Current (mA)	0.005
Phase Control	No
Maximum Gate Trigger Current (mA)	0.2
Maximum Gate Trigger Voltage (V)	0.8
Maximum Rate of Rise of Off-State Voltage (V/us)	10(Min)
Maximum Rate of Rise of On-State Current (A/us)	50
Maximum Gate Peak Inverse Voltage (V)	8(Min)
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Operating Junction Temperature (°C)	-40 to 125
Minimum Storage Temperature (°C)	-40
Maximum Storage Temperature (°C)	150
Temperature Flag	Stg/Jun
Supplier Temperature Grade	Industrial

Supplier Package	TO-92
Basic Package Type	Through Hole
Pin Count	3
Lead Shape	Formed
PCB	3
Tab	N/R
Pin Pitch (mm)	2.54
Package Length (mm)	4.95(Max)
Package Width (mm)	3.94(Max)
Package Height (mm)	4.95(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	4.95(Max)
Package Overall Width (mm)	3.94(Max)
Package Overall Height (mm)	4.95(Max)
Seated Plane Height (mm)	4.95(Max)
Mounting	Through Hole
Package Material	Plastic
Package Description	Plastic Header Style Package
Package Family Name	TO
Jedec	N/A
Package Outline	Link to Datasheet

MSL	N/R
Maximum Reflow Temperature (°C)	N/R
Reflow Solder Time (Sec)	N/R
Number of Reflow Cycle	N/R
Maximum Wave Temperature (°C)	260
Wave Solder Time (Sec)	10
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu Alloy
Shelf Life Period	2 Years
Number of Wave Cycles	2

Packaging	Tape and Reel
Packaging Document	Link to Datasheet