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CATALOG |
XAZU5EV-1SFVC784Q COUNTRY OF ORIGIN
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XAZU5EV-1SFVC784Q PARAMETRIC INFO
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XAZU5EV-1SFVC784Q PACKAGE INFO
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XAZU5EV-1SFVC784Q MANUFACTURING INFO
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XAZU5EV-1SFVC784Q PACKAGING INFO
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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PARAMETRIC INFO
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Device Logic Cells |
256200 |
Device Logic Units |
256200 |
Maximum Number of User I/Os |
156 |
Number of I/O Banks |
3 |
Device Number of DLLs/PLLs |
2 |
Number of Multipliers |
1248 (27x18) |
Tradename |
Zynq® |
Number of Registers |
234240 |
RAM Bits (Kbit) |
3584 |
Total Number of Block RAM |
144 |
Program Memory Type |
Flash |
Family Name |
Zynq® UltraScale |
Speed Grade |
1 |
Transceiver Blocks |
4 |
Transceiver Speed (Gbps) |
12.5 |
Dedicated DSP |
1248 |
Ethernet MACs |
4 |
Copy Protection |
Yes |
Programmability |
Yes |
In-System Programmability |
No |
Reprogrammability Support |
No |
I/O Voltage (V) |
1.2|1.5|1.8|2.5|3.3 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Temperature Flag |
Opr |
Supplier Temperature Grade |
Automotive |
Digital Control Impedance |
Yes |
Typical Operating Supply Voltage (V) |
0.85 |
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PACKAGE INFO
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Supplier Package |
FCBGA |
Basic Package Type |
Ball Grid Array |
Pin Count |
784 |
Lead Shape |
Ball |
PCB |
784 |
Tab |
N/R |
Pin Pitch (mm) |
0.8 |
Package Length (mm) |
23 |
Package Width (mm) |
23 |
Package Height (mm) |
2.72 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
3.12 |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Flip Chip Ball Grid Array |
Package Family Name |
BGA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
250 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
SnAgCu |
Under Plating Material |
N/R |
Terminal Base Material |
N/R |
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PACKAGING INFO
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Packaging Document |
Link to Datasheet |
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