XAZU5EV-1SFVC784Q AMD / Xilinx IC FPGA SOC ZU EV Q100 784SBGA

label:
2025/06/20 17
XAZU5EV-1SFVC784Q AMD / Xilinx  IC FPGA SOC ZU EV Q100 784SBGA


CATALOG
XAZU5EV-1SFVC784Q COUNTRY OF ORIGIN
XAZU5EV-1SFVC784Q PARAMETRIC INFO
XAZU5EV-1SFVC784Q PACKAGE INFO
XAZU5EV-1SFVC784Q MANUFACTURING INFO
XAZU5EV-1SFVC784Q PACKAGING INFO


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Device Logic Cells 256200
Device Logic Units 256200
Maximum Number of User I/Os 156
Number of I/O Banks 3
Device Number of DLLs/PLLs 2
Number of Multipliers 1248 (27x18)
Tradename Zynq®
Number of Registers 234240
RAM Bits (Kbit) 3584
Total Number of Block RAM 144
Program Memory Type Flash
Family Name Zynq® UltraScale
Speed Grade 1
Transceiver Blocks 4
Transceiver Speed (Gbps) 12.5
Dedicated DSP 1248
Ethernet MACs 4
Copy Protection Yes
Programmability Yes
In-System Programmability No
Reprogrammability Support No
I/O Voltage (V) 1.2|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Temperature Flag Opr
Supplier Temperature Grade Automotive
Digital Control Impedance Yes
Typical Operating Supply Voltage (V) 0.85


PACKAGE INFO
Supplier Package FCBGA
Basic Package Type Ball Grid Array
Pin Count 784
Lead Shape Ball
PCB 784
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 23
Package Width (mm) 23
Package Height (mm) 2.72
Package Diameter (mm) N/R
Seated Plane Height (mm) 3.12
Mounting Surface Mount
Package Material Plastic
Package Description Flip Chip Ball Grid Array
Package Family Name BGA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 250
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnAgCu
Under Plating Material N/R
Terminal Base Material N/R


PACKAGING INFO
Packaging Document Link to Datasheet


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