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| CATALOG |
| XC2388E136F128LRAAKXUMA1 COUNTRY OF ORIGIN |
XC2388E136F128LRAAKXUMA1 PARAMETRIC INFO
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XC2388E136F128LRAAKXUMA1 PACKAGE INFO
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XC2388E136F128LRAAKXUMA1 MANUFACTURING INFO
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XC2388E136F128LRAAKXUMA1 PACKAGING INFO
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| COUNTRY OF ORIGIN |
| Germany |
| Malaysia |
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PARAMETRIC INFO
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| Data Bus Width (bit) |
16|32 |
| Device Core |
C166SV2 |
| Maximum Clock Rate (MHz) |
128 |
| Program Memory Type |
Flash |
| Program Memory Size |
1088KB |
| RAM Size |
90KB |
| DMA Channels |
16 |
| Floating Point Unit |
No |
| External Bus Interface |
Yes |
| Number of Programmable I/Os |
118 |
| Real Time Clock |
Yes |
| CAN |
3 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
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PACKAGE INFO
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| Supplier Package |
LQFP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
144 |
| Lead Shape |
Gull-wing |
| PCB |
144 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
20 |
| Package Width (mm) |
20 |
| Package Height (mm) |
1.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
22 |
| Package Overall Width (mm) |
22 |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package, Exposed Pad |
| Package Family Name |
QFP |
| Jedec |
MS-026BFB |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
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| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
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