XC2S50-5TQG144I AMD / Xilinx IC FPGA 92 I/O 144TQFP

label:
2025/08/11 9
XC2S50-5TQG144I AMD / Xilinx 	IC FPGA 92 I/O 144TQFP


CATALOG
XC2S50-5TQG144I COUNTRY OF ORIGIN
XC2S50-5TQG144I LIFECYCLE
XC2S50-5TQG144I PARAMETRIC INFO
XC2S50-5TQG144I PACKAGE INFO
XC2S50-5TQG144I MANUFACTURING INFO
XC2S50-5TQG144I PACKAGING INFO
XC2S50-5TQG144I ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)


LIFECYCLE
Obsolete
Jun 29,2024


PARAMETRIC INFO
Device Logic Gates 50000
Device System Gates 50000
Device Logic Cells 1728
Device Logic Units 1728
Maximum Number of User I/Os 92
Number of I/O Banks 8
Device Number of DLLs/PLLs 4
Tradename Spartan
Maximum I/O Performance 622Mbps
RAM Bits (Kbit) 24
Total Number of Block RAM 32
Program Memory Type SRAM
Maximum Distributed RAM Bits 24576
Family Name Spartan®-II
Process Technology 150nm
Speed Grade 5
Shift Registers Utilize LUT
Programmability Yes
In-System Programmability No
Reprogrammability Support Yes
Maximum Internal Frequency (MHz) 263
Number of Global Clocks 4
Maximum Operating Supply Voltage (V) 2.625
I/O Voltage (V) 1.2|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Jun
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 2.375
Typical Operating Supply Voltage (V) 2.5
Tolerant Configuration Interface Voltage (V) 5


PACKAGE INFO
Supplier Package TQFP
Basic Package Type Lead-Frame SMT
Pin Count 144
Lead Shape Gull-wing
PCB 144
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 20
Package Width (mm) 20
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 22
Package Overall Width (mm) 22
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Terminal Width (mm) 0.22
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Quad Flat Package
Package Family Name QFP
Jedec MS-026BFB
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 1.45
Minimum PACKAGE_DIMENSION_H 1.35
Maximum PACKAGE_DIMENSION_L N/A
Minimum PACKAGE_DIMENSION_L N/A
Maximum PACKAGE_DIMENSION_W N/A
Minimum PACKAGE_DIMENSION_W N/A
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.6
Minimum Seated_Plane_Height 1.4


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard IPC-1752
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu


PACKAGING INFO
Packaging Tape and Reel|Tray
Quantity Of Packaging 60(Max)|750
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ