XC3S100E-4TQG144I AMD / Xilinx IC FPGA 108 I/O 144TQFP

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2025/05/26 11
XC3S100E-4TQG144I AMD / Xilinx IC FPGA 108 I/O 144TQFP


• Very low cost, high-performance logic solution for high-volume, consumer-oriented applications
• Proven advanced 90-nanometer process technology
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• 622+ Mb/s data transfer rate per I/O
• Enhanced Double Data Rate (DDR) support


CATALOG
XC3S100E-4TQG144I LIFECYCLE
XC3S100E-4TQG144I PARAMETRIC INFO
XC3S100E-4TQG144I PACKAGE INFO
XC3S100E-4TQG144I MANUFACTURING INFO
XC3S100E-4TQG144I ECAD MODELS


LIFECYCLE
Obsolete
Jun 29,2024


PARAMETRIC INFO
Device Logic Gates 100000
Device System Gates 100000
Device Logic Cells 2160
Device Logic Units 2160
Maximum Number of User I/Os 108
Number of I/O Banks 4
Device Number of DLLs/PLLs 2
Number of Multipliers 4 (18x18)
Maximum LVDS Data Rate (Mbps) 622
Tradename Spartan
Number of Registers 1920
Maximum Differential I/O Pairs 40
Maximum I/O Performance 622Mbps
RAM Bits (Kbit) 72
Total Number of Block RAM 4
Program Memory Type SRAM
Maximum Distributed RAM Bits 15360
Family Name Spartan®-3E
Process Technology 90nm
Speed Grade 4
Transceiver Speed (Gbps) 0.622
Differential I/O Standards Supported LVDS|LVPECL|RSDS
Single-Ended I/O Standards Supported LVTTL|LVCMOS|SSTL|HSTL
JTAG Support (-) Yes
Maximum Supply Current (mA) 36
Copy Protection No
Shift Registers Utilize Memory
Programmability Yes
In-System Programmability Yes
Number of Look-up Table Input 4
Reprogrammability Support Yes
Maximum Internal Frequency (MHz) 572
Number of Global Clocks 8
Maximum Operating Supply Voltage (V) 1.26
I/O Voltage (V) 1.2|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Jun
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Tolerant Configuration Interface Voltage (V) 3.3


PACKAGE INFO
Supplier Package TQFP
Basic Package Type Lead-Frame SMT
Pin Count 144
Lead Shape Gull-wing
PCB 144
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 20
Package Width (mm) 20
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 22
Package Overall Width (mm) 22
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Quad Flat Package
Package Family Name QFP
Jedec MS-026BFB
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 1.45
Minimum PACKAGE_DIMENSION_H 1.35
Maximum PACKAGE_DIMENSION_L N/A
Minimum PACKAGE_DIMENSION_L N/A
Maximum PACKAGE_DIMENSION_W N/A
Minimum PACKAGE_DIMENSION_W N/A
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.6
Minimum Seated_Plane_Height 1.4


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard IPC-1752
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu


ECAD MODELS


Продукт RFQ