XC3S400-4TQG144I AMD / Xilinx IC FPGA 97 I/O 144TQFP

label:
2025/09/4 3
XC3S400-4TQG144I AMD / Xilinx IC FPGA 97 I/O 144TQFP


CATALOG
XC3S400-4TQG144I COUNTRY OF ORIGIN
XC3S400-4TQG144I PARAMETRIC INFO
XC3S400-4TQG144I PACKAGE INFO
XC3S400-4TQG144I MANUFACTURING INFO
XC3S400-4TQG144I PACKAGING INFO
XC3S400-4TQG144I ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Device Logic Gates 400000
Device System Gates 400000
Device Logic Cells 8064
Device Logic Units 8064
Maximum Number of User I/Os 97
Number of I/O Banks 8
Device Number of DLLs/PLLs 4
Number of Multipliers 16 (18x18)
Number of Inter Dielectric Layers 8
Tradename Spartan
Maximum Differential I/O Pairs 46
Maximum I/O Performance 622Mbps
RAM Bits (Kbit) 288
Total Number of Block RAM 16
Program Memory Type SRAM
Maximum Distributed RAM Bits 57344
Family Name Spartan®-3
Process Technology 90nm
Speed Grade 4
Copy Protection No
Shift Registers Utilize LUT
Programmability No
In-System Programmability Yes
Reprogrammability Support Yes
Maximum Internal Frequency (MHz) 630
Number of Global Clocks 8
Maximum Operating Supply Voltage (V) 1.26
I/O Voltage (V) 1.2|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Jun
Supplier Temperature Grade Industrial
Digital Control Impedance Yes
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Tolerant Configuration Interface Voltage (V) 3.3


PACKAGE INFO
Supplier Package TQFP
Basic Package Type Lead-Frame SMT
Pin Count 144
Lead Shape Gull-wing
PCB 144
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 20
Package Width (mm) 20
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 22
Package Overall Width (mm) 22
Package Overall Height (mm) 1.6(Max)
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Terminal Width (mm) 0.22
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Quad Flat Package
Package Family Name QFP
Jedec MS-026BFB
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_L N/A
Minimum PACKAGE_DIMENSION_L N/A
Maximum PACKAGE_DIMENSION_W N/A
Minimum PACKAGE_DIMENSION_W N/A
Maximum Diameter N/R
Minimum Diameter N/R
Minimum Seated_Plane_Height 1.4
Minimum PACKAGE_DIMENSION_H 1.35
Maximum PACKAGE_DIMENSION_H 1.45
Maximum Seated_Plane_Height 1.6


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard IPC-1752
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel|Tray
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ