XC3S400AN-4FTG256I Xilinx IC FPGA 195 I/O 256FTBGA

label:
2024/02/2 357



• The new standard for low cost nonvolatile FPGA solutions
• Eliminates traditional nonvolatile FPGA limitations with the advanced 90 nm Spartan-3A device feature set • Memory, multipliers, DCMs, SelectIO, hot swap, power management, etc.
• Integrated robust configuration memory • Saves board space • Improves ease-of-use • Simplifies design • Reduces support issues
• Plentiful amounts of nonvolatile memory available to the user • Up to 11+ Mb available • MultiBoot support • Embedded processing and code shadowing • Scratchpad memory
• Robust 100K Flash memory program/erase cycles
• 20 years Flash memory data retention
• Security features provide bitstream anti-cloning protection


CATALOG
XC3S400AN-4FTG256I COUNTRY OF ORIGIN
XC3S400AN-4FTG256I PARAMETRIC INFO
XC3S400AN-4FTG256I PACKAGE INFO
XC3S400AN-4FTG256I PACKAGING INFO


COUNTRY OF ORIGIN
Korea (Republic of)
Taiwan (Province of China)
Philippines
Singapore


PARAMETRIC INFO
Device Logic Gates 400000
Device System Gates 400000
Device Logic Units 8064
Device Logic Cells 8064
Maximum Number of User I/Os 195
Number of I/O Banks 4
Device Number of DLLs/PLLs 4
Number of Multipliers 20 (18x18)
Maximum LVDS Data Rate (Mbps) 622
Tradename Spartan
Maximum Differential I/O Pairs 142
Maximum I/O Performance 622Mbps
RAM Bits (Kbit) 360
Total Number of Block RAM 20
Program Memory Type Flash
Maximum Distributed RAM Bits 57344
Family Name Spartan®-3AN
Process Technology 90nm
Speed Grade 4
Transceiver Speed (Gbps) 0.622
Differential I/O Standards Supported LVDS|LVPECL|RSDS
Single-Ended I/O Standards Supported LVTTL|LVCMOS|SSTL|HSTL
JTAG Support (-) Yes
Maximum Supply Current (mA) 125
Copy Protection Yes
Shift Registers Utilize LUT
Programmability Yes
In-System Programmability Yes
Number of Look-up Table Input 4
Reprogrammability Support Yes
Maximum Internal Frequency (MHz) 667
Number of Global Clocks 8
Maximum Operating Supply Voltage (V) 1.26
I/O Voltage (V) 1.2|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Jun
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Tolerant Configuration Interface Voltage (V) 3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package FTBGA
Basic Package Type Ball Grid Array
Pin Count 256
Lead Shape Ball
PCB 256
Tab N/R
Pin Pitch (mm) 1
Package Length (mm) 17
Package Width (mm) 17
Package Height (mm) 1
Package Diameter (mm) N/R
Package Overall Length (mm) 17
Package Overall Width (mm) 17
Package Overall Height (mm) 1.4
Seated Plane Height (mm) 1.4
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Fine Pitch Thin Ball Grid Array
Package Family Name BGA
Jedec MS-034AAF-1
Package Outline Link to Datasheet


PACKAGING INFO
Packaging Document Link to Datasheet


Продукт RFQ