ГлавнаяБлогXC3S50AN-4TQG144I AMD / Xilinx IC FPGA 108 I/O 144TQFP

XC3S50AN-4TQG144I AMD / Xilinx IC FPGA 108 I/O 144TQFP

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2024/07/23 277
XC3S50AN-4TQG144I AMD / Xilinx IC FPGA 108 I/O 144TQFP


• The new standard for low cost nonvolatile FPGA solutions
• Eliminates traditional nonvolatile FPGA limitations with the advanced 90 nm Spartan-3A device feature set
• Robust 100K Flash memory program/erase cycles
• 20 years Flash memory data retention
• Security features provide bitstream anti-cloning protection


CATALOG
XC3S50AN-4TQG144I LIFE CYCLE
XC3S50AN-4TQG144I PARAMETER INFORMATION
XC3S50AN-4TQG144I PACKAGING INFORMATION
XC3S50AN-4TQG144I MANUFACTURING INFORMATION
XC3S50AN-4TQG144I ECAD MODELS


LIFE CYCLE
Obsolete Jun 29, 2024


PARAMETER INFORMATION
Device Logic Gates 50000
Device System Gates 50000
Device Logic Units 1584
Device Logic Cells 1584
Maximum Number of User I/Os 108
Number of I/O Banks 4
Device Number of DLLs/PLLs 2
Number of Multipliers 3 (18x18)
Maximum LVDS Data Rate (Mbps) 622
Tradename Spartan
Maximum Differential I/O Pairs 64
Maximum I/O Performance 622Mbps
RAM Bits (Kbit) 54
Total Number of Block RAM 3
Program Memory Type Flash
Maximum Distributed RAM Bits 11264
Series Name Spartan®-3AN
Process Technology 90nm
Speed Grade 4
Transceiver Speed (Gbps) 0.622
Differential I/O Standards Supported LVDS|LVPECL|RSDS
Single-Ended I/O Standards Supported LVTTL|LVCMOS|SSTL|HSTL
JTAG Support (-) yes
Maximum Supply Current (mA) 30
Copy Protection yes
Shift Registers Utilize LUT
Programmability yes
In-System Programmability yes
Number of Look-up Table Input 4
Reprogrammability Support yes
Maximum Internal Frequency (MHz) 667
Number of Global Clocks 8
Maximum Operating Supply Voltage (V) 1.26
I/O Voltage (V) 1.2|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag June
Vendor Temperature Grade Industrial
Digital Control Impedance no
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Tolerant Configuration Interface Voltage (V) 3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGING INFORMATION
Supplier Packaging TQFP
Basic package types Lead-Frame SMT
Number of Pins 144
Pin shape Gull-wing
PCB 144
Ear piece N/R
Pin spacing (mm) 0.5
Package length (mm) 20
Package width (mm) 20
Package height (mm) 1.4
Package diameter (mm) N/R
Mounting surface height (mm) 1.6(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Thin Quad Flat Package
Package Series Name QFP
JEDEC MS-026BFB
Package Outline Link to data sheet


MANUFACTURING INFORMATION
MSL 3
Maximum reflow temperature (°C) 260
Reflow time (seconds) 30
Reflow cycles 3
standard not applicable
Reflow temperature source Link to data sheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal base material Cu
Number of Wave Cycles N/R


ECAD MODELS

Продукт RFQ