XC6SLX25-2FGG484C Xilinx IC FPGA 266 I/O 484FBGA

label:
2023/12/18 442



CATALOG
XC6SLX25-2FGG484C COUNTRY OF ORIGIN
XC6SLX25-2FGG484C PARAMETRIC INFO
XC6SLX25-2FGG484C PACKAGE INFO
XC6SLX25-2FGG484C MANUFACTURING INFO
XC6SLX25-2FGG484C PACKAGING INFO


COUNTRY OF ORIGIN
Korea (Republic of)
Taiwan (Province of China)


PARAMETRIC INFO
Device Logic Units 24051
Device Logic Cells 24051
Maximum Number of User I/Os 266
Number of I/O Banks 4
Device Number of DLLs/PLLs 2
Number of Multipliers 38 (18x18)
Maximum DSP Block Frequency (MHz) 390
Tradename Spartan
Number of Registers 30064
Maximum I/O Performance 3.2Gbps
RAM Bits (Kbit) 936
Total Number of Block RAM 52
Program Memory Type SRAM
Maximum Distributed RAM Bits 234496
Family Name Spartan®-6 LX
Process Technology 45nm
Speed Grade 2
Transceiver Speed (Gbps) 3.2
Dedicated DSP 38
JTAG Support (-) Yes
External Memory Interface DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
Copy Protection Yes
Shift Registers Utilize LUT
Programmability Yes
In-System Programmability No
Number of Look-up Table Input 6
Reprogrammability Support Yes
Number of Global Clocks 16
Maximum Operating Supply Voltage (V) 1.26
I/O Voltage (V) 1.8|2.5
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Temperature Flag Jun
Supplier Temperature Grade Commercial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package FBGA
Basic Package Type Ball Grid Array
Pin Count 484
Lead Shape Ball
PCB 484
Tab N/R
Pin Pitch (mm) 1
Package Length (mm) 23
Package Width (mm) 23
Package Height (mm) 1.7
Package Diameter (mm) N/R
Package Overall Length (mm) 23
Package Overall Width (mm) 23
Package Overall Height (mm) 2.2
Seated Plane Height (mm) 2.2
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Jedec MS-034AAJ-1
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 250
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard IPC-1752
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material CuNi
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 60(Max)
Packaging Document Link to Datasheet

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