XC6SLX45-3FGG484I AMD / Xilinx IC FPGA 316 I/O 484FBGA

label:
2024/05/28 376

CATALOG
XC6SLX45-3FGG484I COUNTRY OF ORIGIN
XC6SLX45-3FGG484I PARAMETRIC INFO
XC6SLX45-3FGG484I PACKAGE INFO
XC6SLX45-3FGG484I MANUFACTURING INFO



COUNTRY OF ORIGIN
Taiwan (Province of China)



PARAMETRIC INFO
Device Logic Units 43661
Device Logic Cells 43661
Maximum Number of User I/Os 316
Number of I/O Banks 4
Device Number of DLLs/PLLs 12
Number of Multipliers 116 (18x18)
Tradename Spartan
Number of Registers 54576
Maximum I/O Performance 3.125Gbps
RAM Bits (Kbit) 2088
Total Number of Block RAM 116
Program Memory Type SRAM
Maximum Distributed RAM Bits 410624
Family Name Spartan®-6 LX
Process Technology 45nm
Speed Grade 3
Transceiver Speed (Gbps) 3.2
Dedicated DSP 58
Copy Protection Yes
Shift Registers Utilize LUT
Programmability Yes
In-System Programmability No
Reprogrammability Support Yes
Number of Global Clocks 16
Maximum Operating Supply Voltage (V) 1.26
I/O Voltage (V) 1.8|2.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Jun
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65



PACKAGE INFO
Supplier Package FBGA
Basic Package Type Ball Grid Array
Pin Count 484
Lead Shape Ball
PCB 484
Tab N/R
Pin Pitch (mm) 1
Package Length (mm) 23
Package Width (mm) 23
Package Height (mm) 1.7
Package Diameter (mm) N/R
Package Overall Length (mm) 23
Package Overall Width (mm) 23
Package Overall Height (mm) 2.2
Seated Plane Height (mm) 2.2
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Jedec N/A
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 250
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard IPC-1752
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material CuNi



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