XC7S75-1FGGA484C AMD / Xilinx XC7S75-1FGGA484C

label:
2024/08/5 198
XC7S75-1FGGA484C AMD / Xilinx XC7S75-1FGGA484C


CATALOG
XC7S75-1FGGA484C COUNTRY OF ORIGIN
XC7S75-1FGGA484C PARAMETRIC INFO
XC7S75-1FGGA484C PACKAGE INFO
XC7S75-1FGGA484C MANUFACTURING INFO
XC7S75-1FGGA484C PACKAGING INFO
XC7S75-1FGGA484C ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Device Logic Units 76800
Device Logic Cells 76800
Maximum Number of User I/Os 338
Number of I/O Banks 8
Device Number of DLLs/PLLs 8
Number of Multipliers 140 (25x18)
Number of Regional Clocks 4
Maximum LVDS Data Rate (Mbps) 1250
Tradename Spartan
RAM Bits (Kbit) 3240
Total Number of Block RAM 90
Program Memory Type SRAM
Maximum Distributed RAM Bits 832
Family Name Spartan®-7
Process Technology 28nm
Speed Grade 1
Dedicated DSP 140
JTAG Support (-) Yes
Copy Protection Yes
Shift Registers Utilize LUT
Programmability Yes
In-System Programmability Yes
Number of Look-up Table Input 6
Reprogrammability Support Yes
Number of Global Clocks 32
Maximum Operating Supply Voltage (V) 1.05
I/O Voltage (V) 1.2|1.35|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Temperature Flag Jun
Supplier Temperature Grade Commercial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 0.95
Typical Operating Supply Voltage (V) 1
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package FBGA
Basic Package Type Ball Grid Array
Pin Count 484
Lead Shape Ball
PCB 484
Tab N/R
Pin Pitch (mm) 1
Package Length (mm) 23
Package Width (mm) 23
Package Height (mm) 1.7
Package Diameter (mm) N/R
Package Overall Length (mm) 23
Package Overall Width (mm) 23
Package Overall Height (mm) 2.2
Seated Plane Height (mm) 2.2
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Jedec MS-034AAJ-1
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 60(Max)
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ