XC7Z010-1CLG225I AMD / Xilinx IC SOC CORTEX-A9 ARTIX-7 225BGA

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2024/09/13 195
XC7Z010-1CLG225I AMD / Xilinx 	IC SOC CORTEX-A9 ARTIX-7 225BGA


CATALOG
XC7Z010-1CLG225I COUNTRY OF ORIGIN
XC7Z010-1CLG225I PARAMETRIC INFO
XC7Z010-1CLG225I PACKAGE INFO


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Device Logic Units 28000
Device Logic Cells 28000
Maximum Number of User I/Os 84
Number of I/O Banks 4
Device Number of DLLs/PLLs 2
Number of Multipliers 80 (25×18)
Number of Regional Clocks 4
Maximum LVDS Data Rate (Mbps) 1250
Tradename Zynq®
Number of Registers 35200
RAM Bits (Kbit) 2150.4
Total Number of Block RAM 60
Program Memory Type SRAM
Family Name Zynq®-7000
Process Technology 28nm
Speed Grade 1
Dedicated DSP 80
Differential I/O Standards Supported LVDS|SSTL|HSTL
Ethernet MACs 2
JTAG Support (-) Yes
Copy Protection Yes
Shift Registers Utilize LUT
Programmability Yes
In-System Programmability Yes
Reprogrammability Support No
Number of Global Clocks 32
Maximum Operating Supply Voltage (V) 1.05
I/O Voltage (V) 1.2|1.35|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Jun
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 0.95
Typical Operating Supply Voltage (V) 1
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package CSBGA
Basic Package Type Ball Grid Array
Pin Count 225
Lead Shape Ball
PCB 225
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 13
Package Width (mm) 13
Package Height (mm) 1.06
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.5(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Chip Scale Ball Grid Array
Package Family Name BGA
Package Outline Link to Datasheet

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