XCF02SVOG20C Xilinx IC PROM SRL FOR 2M GATE 20-TSSOP

label:

2023/11/13 350

• In-System Programmable PROMs for Configuration of Xilinx® FPGAs

• Low-Power Advanced CMOS NOR Flash Process

• Endurance of 20,000 Program/Erase Cycles

• Operation over Full Industrial Temperature Range (–40°C to +85°C)

• IEEE Standard 1149.1/1532 Boundary-Scan (JTAG) Support for Programming, Prototyping, and Testing

• JTAG Command Initiation of Standard FPGA Configuration

• Cascadable for Storing Longer or Multiple Bitstreams

• Dedicated Boundary-Scan (JTAG) I/O Power Supply (VCCJ)

• I/O Pins Compatible with Voltage Levels Ranging From 1.8V to 3.3V

• Design Support Using the Xilinx ISE® Alliance and Foundation™ Software Packages

• XCF01S/XCF02S/XCF04S
• 3.3V Supply Voltage
• Serial FPGA Configuration Interface
• Available in Small-Footprint VO20 and VOG20 Packages

• XCF08P/XCF16P/XCF32P
• 1.8V Supply Voltage
• Serial or Parallel FPGA Configuration Interface
• Available in Small-Footprint VOG48, FS48, and FSG48 Packages
• Design Revision Technology Enables Storing and Accessing Multiple Design Revisions for Configuration
• Built-In Data Decompressor Compatible with Xilinx Advanced Compression Technology

CATALOG

XCF02SVOG20C COUNTRY OF ORIGIN

XCF02SVOG20C LIFECYCLE

XCF02SVOG20C PARAMETRIC INFO

XCF02SVOG20C PACKAGE INFO

XCF02SVOG20C MANUFACTURING INFO

XCF02SVOG20C PACKAGING INFO

COUNTRY OF ORIGIN

China

Singapore

Taiwan (Province of China)

LIFECYCLE

Obsolete
Jun 30,2021

PARAMETRIC INFO

Memory Type	Flash
Memory Size (bit)	2M
Programmable Type	ISP
Reprogrammability	Yes
Interface Type	Serial
Minimum Operating Supply Voltage (V)	3
Supplier Temperature Grade	Industrial
Typical Operating Supply Voltage (V)	3.3
Maximum Operating Supply Voltage (V)	3.6
Process Technology	CMOS
Minimum Operating Temperature (°C)	-40
I/O Mode	Serial
Maximum Operating Temperature (°C)	85
Associated FPGA Family	Xilinx®

PACKAGE INFO

Supplier Package	TSSOP
Basic Package Type	Lead-Frame SMT
Pin Count	20
Lead Shape	Gull-wing
PCB	20
Tab	N/R
Pin Pitch (mm)	0.65
Package Length (mm)	6.5
Package Width (mm)	4.39
Package Height (mm)	1.04(Max)
Package Diameter (mm)	N/R
Seated Plane Height (mm)	1.19(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Thin Shrink Small Outline Package
Package Family Name	SO
Jedec	MO-153AC
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	N/A
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	Ag
Terminal Base Material	Cu Alloy
Number of Wave Cycles	N/R

PACKAGING INFO

Packaging	Tube
Quantity Of Packaging	74