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• In-System Programmable Flash Memory Optimized for Virtex®-5 or Virtex-6 FPGA Configuration
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• High-Performance FPGA Bitstream Transfer up to 800 Mb/s (50 MHz 16-bits), Ideal for PCI Express® Endpoint Applications
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• MultiBoot Bitstream, Design Revision Storage
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• FPGA Configuration Synchronization (READY_WAIT)Handshake Signal
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• ISE® Software Support for In-System Programming via Xilinx® JTAG Cables
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• Standard NOR-Flash Interface for Access to Code or Data Storage
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• Operation over Full Industrial Temperature Range(–40°C to +85°C)
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• Common Flash Interface (CFI)
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• Low-Power Advanced CMOS NOR-Flash Process
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| CATALOG |
XCF128XFTG64C COUNTRY OF ORIGIN
|
| XCF128XFTG64C LIFECYCLE |
XCF128XFTG64C PARAMETRIC INFO
|
XCF128XFTG64C PACKAGE INFO
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XCF128XFTG64C MANUFACTURING INFO
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XCF128XFTG64C PACKAGING INFO
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COUNTRY OF ORIGIN
|
China
|
|
| LIFECYCLE |
Obsolete
Jul 31,2022 |
|
PARAMETRIC INFO
|
| Programmability |
Yes |
| Function |
Configuration Device |
| Minimum Operating Supply Voltage (V) |
1.7 |
| Maximum Operating Supply Voltage (V) |
2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
125 |
| Process Technology |
CMOS |
|
|
PACKAGE INFO
|
| Supplier Package |
FTBGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
64 |
| Lead Shape |
Ball |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
1 |
| Package Length (mm) |
13 |
| Package Width (mm) |
10 |
| Package Height (mm) |
0.8 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Fine Pitch Thin Ball Grid Array |
| Package Family Name |
BGA |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu Alloy |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Document |
Link to Datasheet |
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