|
| |
• Input Voltage : 2.7V ~ 5.5V
|
• Output Voltage : 0.8V ~ 3.6V
|
• Oscillation Frequency : 3.0MHz
|
| • Output Current : 1.5A
|
| • Efficiency : 92% (VIN=5.0V, VOUT=3.3V/500mA) |
| • Control Methods : HiSAT-COT 100% Duty Cycle HiSAT-COT+PWM (XCL213) HiSAT-COT+PWM/PFM (XCL214) |
| • Circuit Protection : Thermal Shut Down Current Limit Circuit (Drop) Short Circuit Protection (Latch) |
| •
Functions : Soft-start Circuit Built-in UVLO CL Discharge
|
| • Output Capacitor : Low ESR Ceramic Capacitor |
| • Operating Ambient Temperature : -40℃~ 105℃ |
| • Package : USP-9B01 |
| • Environmental Friendly : EU RoHS Compliant, Pb Free |
| |
| CATALOG |
| XCL214B183DR COUNTRY OF ORIGIN |
| XCL214B183DR LIFE CYCLE |
XCL214B183DR PARAMETRIC INFO
|
XCL214B183DR PACKAGE INFO
|
XCL214B183DR MANUFACTURING INFO
|
XCL214B183DR PACKAGING INFO
|
XCL214B183DR EACD MODELS
|
| XCL214B183DR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Japan |
| |
| LIFE CYCLE |
| Obsolete Jun 30, 2022 |
| |
PARAMETRIC INFO
|
| type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
2.7 |
| Maximum Input Voltage (V) |
5.5 |
| Output Voltage (V) |
1.8 |
| Maximum Output Current (A) |
1.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Switching Frequency (kHz) |
300 |
| Efficiency (%) |
92 |
| Switching Regulator |
yes |
| Output Type |
Fixed |
| Typical Quiescent Current (uA) |
25 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
|
|
PACKAGE INFO
|
| Supplier packaging |
USP-B01 |
| Number of pins |
9 |
| PCB |
9 |
| ears |
N/R |
| Package length (mm) |
3.2 |
| Package width (mm) |
2.5 |
| Package height (mm) |
1 |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
1 |
| Install |
Surface Mount |
| Package outline |
Link to datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
10 |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
not applicable |
| Plating materials |
not applicable |
| Terminal Base Material |
not applicable |
|
|
PACKAGING INFO
|
| Packaging Suffix |
DR |
| Package |
Tape and reel packaging |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • Note Book PC |
| •
Tablet PC
|
| • SSD |
| • Mobile phone |
| • Projector |
| • Printer |
| |
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