XCR3128XL-10VQG100I AMD / Xilinx IC CPLD 128MC 9.1NS 100VQFP

label:
2025/01/23 5
XCR3128XL-10VQG100I AMD / Xilinx IC CPLD 128MC 9.1NS 100VQFP


CATALOG
XCR3128XL-10VQG100I COUNTRY OF ORIGIN
XCR3128XL-10VQG100I LIFECYCLE
XCR3128XL-10VQG100I PARAMETRIC INFO
XCR3128XL-10VQG100I PACKAGE INFO
XCR3128XL-10VQG100I MANUFACTURING INFO
XCR3128XL-10VQG100I PACKAGING INFO
XCR3128XL-10VQG100I ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)


LIFECYCLE
Obsolete
Jun 29,2024


PARAMETRIC INFO
Device System Gates 3000
Number of User I/Os 84
Number of Logic Blocks/Elements 8
Number of Macro Cells 128
Number of Product Terms per Macro 48
Number of Inter Dielectric Layers 5
Number of Flip Flops 128
Tradename CoolRunner
Copy Protection No
Number of Global Clocks 4
Program Memory Type EEPROM
Family Name CoolRunner XPLA3
Process Technology 0.35um
Speed Grade 10
Data Gate No
Individual Output Enable Control No
Programmability Yes
In-System Programmability Yes
Reprogrammability Support Yes
Maximum Internal Frequency (MHz) 125
Maximum Operating Frequency (MHz) 95
Maximum Clock to Output Delay (ns) 6.5
Maximum Propagation Delay Time (ns) 10
Tolerant Configuration Interface Voltage (V) 5
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3.3
Programmable Type In System Programmable
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package VTQFP
Basic Package Type Lead-Frame SMT
Pin Count 100
Lead Shape Gull-wing
PCB 100
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 14
Package Width (mm) 14
Package Height (mm) 1
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Thin Quad Flat Package
Package Family Name QFP
Jedec MS-026AED
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu
Number of Wave Cycles N/R
 
PACKAGING INFO
Packaging Document Link to Datasheet
 
ECAD MODELS
Продукт RFQ