XCZU4CG-1SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA

label:
2023/11/21 415




CATALOG
XCZU4CG-1SFVC784E PARAMETRIC INFO
XCZU4CG-1SFVC784E PACKAGE INFO
XCZU4CG-1SFVC784E PACKAGING INFO


PARAMETRIC INFO
Device Logic Units 192150
Device Logic Cells 192150
Maximum Number of User I/Os 156
Number of I/O Banks 3
Device Number of DLLs/PLLs 8
Number of Multipliers 728 (27x18)
Tradename Zynq®
Number of Registers 175680
Maximum I/O Performance 16.3Gbps
RAM Bits (Kbit) 2662.4
Total Number of Block RAM 128
Program Memory Type SRAM
Maximum Distributed RAM Bits 2726297.6
Family Name Zynq® UltraScale
Process Technology 20nm
Speed Grade 1
Transceiver Blocks 16
Dedicated DSP 728
Ethernet MACs 4
JTAG Support (-) Yes
PCI Blocks 2
Copy Protection Yes
Shift Registers Utilize Memory
Programmability Yes
In-System Programmability No
Number of Look-up Table Input 6
Reprogrammability Support No
Maximum Operating Supply Voltage (V) 0.979
I/O Voltage (V) 1.2|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 100
Temperature Flag Opr
Supplier Temperature Grade Extended
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 0.922
Typical Operating Supply Voltage (V) 0.95
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package FC-FBGA
Basic Package Type Ball Grid Array
Pin Count 784
Lead Shape Ball
PCB 784
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 23
Package Width (mm) 23
Package Height (mm) 2.72
Package Diameter (mm) N/R
Seated Plane Height (mm) 3.12
Mounting Surface Mount
Package Material Plastic
Package Description Flip Chip Fine Pitch Ball Grid Array
Package Family Name BGA
Package Outline Link to Datasheet


PACKAGING INFO
Packaging Document Link to Datasheet

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